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Samtec Rugged High-Speed 20-Contact 2-Row Straight Surface PCB Socket, 0.8 mm Pitch, 2.2A, 318V ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin China
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Rugged High-Speed Socket Strip
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 20
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Designed for rugged, high-speed electronic applications requiring robust signal integrity.
  • Features a compact 0.8 mm pitch and 4.5 mm row pitch for dense PCB layouts.
  • Supports a current rating of 2.2 A and voltage rating of 318 V for reliable performance.
  • Housing made from liquid crystal polymer ensures durability and thermal stability.
  • Gold-plated beryllium copper alloy contacts deliver improved conductivity and corrosion resistance.
  • Surface mount termination type facilitates automated PCB assembly processes.
  • Stacking height of 18 mm supports versatile impedance control and connector stacking.
  • Operates reliably across a temperature range from -55°C to 125°C for harsh environments.

Product Description

Samtec ERF8 Series rugged high-speed PCB socket features a 20-contact configuration in 2 rows with a fine 0.8 mm pitch, ensuring compact and efficient board-to-board connections. Its straight orientation and surface mount termination make it suitable for modern PCB assembly processes. The housing is made from high-quality liquid crystal polymer, providing excellent thermal stability and mechanical strength.

This socket supports a current of 2.2 A and a voltage of up to 318 V, making it ideal for demanding electronic applications in industrial, telecommunications, and computing sectors. The contacts are manufactured from beryllium copper alloy with gold plating, ensuring low contact resistance, high conductivity, and corrosion resistance for long-term durability.

The component offers a stacking height of 18 mm, facilitating multi-level connector design and precise impedance control. It withstands operating temperatures from -55°C to 125°C, suitable for harsh environmental conditions. The 4.5 mm row pitch and rugged edge rate® contact technology enhance wear resistance and signal integrity.

Ideal for industrial, telecommunications, electronic manufacturing, and laboratory use, this PCB socket conforms to established standards and is dual sourced by Hirose. Its robust design ensures reliable connectivity in complex electronic systems.

Designed for rugged, high-speed electronic applications requiring robust signal integrity. Features a compact 0.8 mm pitch and 4.5 mm row pitch for dense PCB layouts. Supports a current rating of 2.2 A and voltage rating of 318 V for reliable performance.

Housing made from liquid crystal polymer ensures durability and thermal stability. Gold-plated beryllium copper alloy contacts deliver improved conductivity and corrosion resistance. Surface mount termination type facilitates automated PCB assembly processes.

Stacking height of 18 mm supports versatile impedance control and connector stacking. Operates reliably across a temperature range from -55°C to 125°C for harsh environments. Connector system designed for board-to-board interfacing with a straight orientation.

Complies with rugged edge rate® contact standards for enhanced wear life. Explore advanced PCB Sockets and electronic components on EnvMart for high-performance industrial and commercial applications.

Samtec Rugged High-Speed 20-Contact 2-Row Straight Surface PCB Socket, 0.8 mm Pitch, 2.2A, 318V ERF8
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Frequently Asked Questions

It supports a current rating of 2.2 A and a voltage rating of 318 V, making it suitable for demanding electronic applications.

The contacts have a compact pitch of 0.8 mm, which is designed for dense PCB layouts.

The housing is made from liquid crystal polymer, while the contacts are made from beryllium copper alloy with gold plating for improved conductivity and corrosion resistance.

The stacking height is 18 mm, which supports versatile impedance control and connector stacking.

It operates reliably across a temperature range from -55°C to 125°C, making it suitable for harsh environments.

This model features 20 contacts arranged in 2 rows, facilitating efficient board-to-board connections.

It utilizes a surface mount termination type, which facilitates automated PCB assembly processes.

The row pitch is 4.5 mm, which helps in maintaining compact designs on PCBs.

The connector has a straight orientation, designed for board-to-board interfacing.

It conforms to a board-to-board connector system, ideal for various electronic applications.

This PCB socket can support up to 200 positions, allowing for flexible design options in PCB layouts.

The country of origin for this product is China.

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