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| Country of Origin | China |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 20 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
Samtec ERF8 Series rugged high-speed PCB socket features a 20-contact configuration in 2 rows with a fine 0.8 mm pitch, ensuring compact and efficient board-to-board connections. Its straight orientation and surface mount termination make it suitable for modern PCB assembly processes. The housing is made from high-quality liquid crystal polymer, providing excellent thermal stability and mechanical strength.
This socket supports a current of 2.2 A and a voltage of up to 318 V, making it ideal for demanding electronic applications in industrial, telecommunications, and computing sectors. The contacts are manufactured from beryllium copper alloy with gold plating, ensuring low contact resistance, high conductivity, and corrosion resistance for long-term durability.
The component offers a stacking height of 18 mm, facilitating multi-level connector design and precise impedance control. It withstands operating temperatures from -55°C to 125°C, suitable for harsh environmental conditions. The 4.5 mm row pitch and rugged edge rate® contact technology enhance wear resistance and signal integrity.
Ideal for industrial, telecommunications, electronic manufacturing, and laboratory use, this PCB socket conforms to established standards and is dual sourced by Hirose. Its robust design ensures reliable connectivity in complex electronic systems.
Designed for rugged, high-speed electronic applications requiring robust signal integrity. Features a compact 0.8 mm pitch and 4.5 mm row pitch for dense PCB layouts. Supports a current rating of 2.2 A and voltage rating of 318 V for reliable performance.
Housing made from liquid crystal polymer ensures durability and thermal stability. Gold-plated beryllium copper alloy contacts deliver improved conductivity and corrosion resistance. Surface mount termination type facilitates automated PCB assembly processes.
Stacking height of 18 mm supports versatile impedance control and connector stacking. Operates reliably across a temperature range from -55°C to 125°C for harsh environments. Connector system designed for board-to-board interfacing with a straight orientation.
Complies with rugged edge rate® contact standards for enhanced wear life. Explore advanced PCB Sockets and electronic components on EnvMart for high-performance industrial and commercial applications.
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