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Samtec Rugged High-Speed PCB Socket, 150 Contacts, 2 Row, 0.8 mm Pitch, Surface Mount, Straight Orientation ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Rugged High-Speed Socket Strip
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 150
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Constructed with liquid crystal polymer housing for durability.
  • Provides up to 2.2A current and 318V voltage rating.
  • Gold-plated beryllium copper alloy contacts ensure superior conductivity and corrosion resistance.
  • Designed with a straight orientation for board-to-board connector system compatibility.
  • Operates reliably in temperatures from -55°C to 125°C.
  • Stacking height of 18 mm supports versatile PCB configurations.
  • Dual sourced by Hirose for supply chain reliability.
  • Suitable for high-speed data transfer up to 28+ Gbps.

Product Description

Samtec ERF8 series PCB socket is a rugged high-speed, straight surface mount socket designed for demanding electronic component applications. Featuring 150 contacts arranged in 2 rows with a fine pitch of 0.8 mm, this surface mount socket is optimized for board-to-board connection systems requiring high reliability and signal integrity.

The housing is made of durable liquid crystal polymer, providing robust mechanical stability and resistance to environmental stresses. Contacts are manufactured from beryllium copper alloy with gold plating, offering excellent electrical conductivity and protection against corrosion, ensuring long service life in industrial and commercial electronics.

Rated for currents up to 2.2 A and voltages up to 318 V, the ERF8 socket is appropriate for various power and signal applications. Operating temperature range from a low of -55°C to a maximum of 125°C makes it suitable for harsh environments and industrial-grade usage.

Stacking height measures 18 mm, supporting modular PCB stacking configurations. Its straight orientation assists in accommodating different board layouts with ease. The socket design is dual sourced by Hirose, ensuring availability and stringent quality controls.

Liquid crystal polymer housing for enhanced durability. Beryllium copper alloy gold-plated contacts for superior conductivity. High current and voltage ratings suited to demanding applications. Wide operating temperature range for industrial and commercial use.

Compatible with board-to-board connector systems. Supports high-speed data transfer up to 28+ Gbps. Positions available up to 200 contacts for complex circuits.

This PCB socket series is ideal for use in electronics manufacturing, telecommunications, computing hardware, and networking equipment applications. Explore Samtec products and other PCB Socket options on EnvMart for your connectivity needs.

Samtec Rugged High-Speed PCB Socket, 150 Contacts, 2 Row, 0.8 mm Pitch, Surface Mount, Straight Orientation ERF8
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Frequently Asked Questions

The maximum voltage rating for this model is 318V.

It can handle a current of up to 2.2A.

The contact pitch size is 0.8 mm.

The housing is constructed from liquid crystal polymer, which provides durability.

This model features 150 contacts arranged in 2 rows.

The stacking height measures 18 mm, allowing for versatile PCB configurations.

It operates reliably in temperatures ranging from -55°C to 125°C.

It is designed for board-to-board connector systems.

The contacts are made from beryllium copper alloy and are gold-plated for superior conductivity.

The termination type is solder, which is suitable for surface mounting.

This model is dual sourced by Hirose, ensuring supply chain reliability.

It is suitable for use in electronics manufacturing, telecommunications, computing hardware, and networking equipment applications.

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