Samtec QSE Series Straight Surface PCB Socket 28-Contact 2 Row 0.8 mm Pitch Solder QSE-014-01-L-D-DP-A

Samtec QSE-014-01-L-D-DP-A is a straight surface mount PCB socket tailored for high-performance board-to-board connections. This 28-contact, 2-row socket features a 0.8 mm pitch and a low profile 5 mm stacking height, making it ideal for space-constrained electronic assemblies. Constructed from liquid crystal polymer housing and equipped with bronze contacts plated in gold, the socket delivers excellent durability, signal integrity, and corrosion resistance.

Rated for 23 A current and 225 V voltage, it supports demanding electrical requirements in industrial electronics, telecommunications, computing, and automotive applications. The socket’s temperature range from -55°C to 125°C enables reliable operation across a wide spectrum of environmental conditions.

Its straight orientation and board-to-board connector system design facilitate easy integration into multilayer PCBs and complex electronic modules. The 0.80 mm Q Pairs® high-speed ground plane socket strip supports frequencies up to 8.5 GHz and data rates of 17 Gbps, making it suitable for high-speed signal transmission in advanced electronic circuits.

Features a 0.80 mm Q Pairs® high-speed ground plane socket strip for enhanced signal integrity. Supports up to 23 A current and 225 V voltage rating for reliable electrical performance. Body made of liquid crystal polymer housing for durability and thermal stability.

Gold plated bronze contacts ensure excellent corrosion resistance and conductivity. Low profile 5 mm stacking height suits compact board-to-board connector systems. Operates within a temperature range from -55°C to 125°C for versatile environmental conditions.

Designed for straight orientation and board-to-board connector systems.

This connector is broadly applicable in industrial automation, telecommunications equipment, computing devices, aerospace, and automotive electronics where dependable and precise PCB interconnections are critical. Its robust construction and high-speed capabilities support next-generation electronic designs.

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