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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter SOP to DIP W9505RC

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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter SOP to DIP W9505RC

Name: Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter SOP to DIP W9505RC
Brand: Winslow
SKU: 147877

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Category IC Socket Adapter Brand Winslow Condition New

Specifications

Country of Origin	India
Brand	Winslow
Orientation	Straight
Model	W9505RC
Mount Type	Through Hole
Housing Material	FR4
Contact Material	Brass
Series	SOP-DIP Iss5
Pitch	2.54mm
Contact Plating	Gold over Nickel
Connection Gender A	Female
Number of Contacts A	20
Connection Gender B	Male
PCB	Epoxy Fibreglass FR4
Connection A	SOP
Connection B	DIP
CIF 1.27 mm, 2.54 mm Pitch IC Socket AdapterBrand	CIF

Key Features

This adapter converts Small Outline ICs (SOIC) to dual in line (DIP) package configuration with a pitch of 2.54 mm.
It features 20 female contacts on the SOIC side and 20 male contacts on the DIP side.
The contact plating is gold over nickel ensuring reliable electrical connectivity.
Mounting type is through hole with straight orientation for easy PCB integration.
The housing material is high-quality FR4 epoxy fiberglass ensuring durability and insulation.
Contact material is brass providing good conductivity and mechanical strength.
This product supports SOP-DIP series and is suitable for prototype and development use.
The PCB material is epoxy fiberglass FR4 for excellent mechanical and electrical performance.

Product Description

Winslow W9505RC is a high-quality straight through hole mount IC socket adapter designed for converting Small Outline ICs (SOIC) to Dual In Line Package (DIP) format with a 2.54 mm pitch.

This adapter supports 20 contacts on both SOIC (female) and DIP (male) sides, making it ideal for use in electronic prototyping and development where package compatibility needs to be bridged.

The contact plating of gold over nickel offers excellent electrical conductivity and corrosion resistance. The contacts are made of brass to ensure mechanical robustness and reliable connections.

The housing is constructed from durable FR4 epoxy fiberglass providing insulation and structural support. The PCB is also made from epoxy fiberglass FR4, ensuring stable mounting and reliable performance in demanding environments.

This product is part of the SOP-DIP Iss5 series and features through hole mounting with a straight orientation, making it straightforward to integrate onto printed circuit boards. The adapter facilitates development cost savings by allowing circuit designs originally intended for SOIC packages to be used with DIP sockets without redesigning the boards.

This adapter converts Small Outline ICs (SOIC) to dual in line (DIP) package configuration with a pitch of 2.54 mm. Features 20 female contacts (SOIC) and 20 male contacts (DIP). Contact plating is gold over nickel for improved conductivity and durability.

Made with brass contacts and FR4 epoxy fiberglass housing for strength and insulation. Through hole mount type with straight orientation for easy PCB installation.

This IC socket adapter is suitable for use in electronics manufacturing, prototyping, and laboratory environments where package format conversion is required. It supports modifications in circuit design development and testing without costly PCB redesigns.

Explore more IC Socket Adapters and electronic component solutions with EnvMart’s extensive catalog to meet your development and manufacturing needs.