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HARWIN 6 mm Surface Mount Titanium Copper Alloy Spring Contact S7051-42R

Category Grounding Contacts Brand HARWIN Condition New

Specifications

Country of Origin India
Brand HARWIN
Material Titanium Copper Alloy
Current 4A
Height 6mm
Length 4mm
Model S7051-42R
Width 2.5mm
Contact Plating Nickel Plated
Fixing Method Surface Mount

Key Features

  • Constructed from titanium copper alloy for high conductivity and durability.
  • Surface mount fixing method ensures efficient PCB assembly.
  • Nickel plated contact for excellent corrosion resistance.
  • Rated for a current of 4A suitable for lightweight electrical applications.
  • Designed as a closed type with protected tips preventing hooking during installation.
  • Compatible with standard pick and place equipment for ease of manufacturing.
  • Effective in EMC noise and static prevention across multiple PCBs.

Product Description

HARWIN S7051-42R is a 6 mm high surface mount spring contact designed for electronic grounding applications in industrial and manufacturing environments. Made from titanium copper alloy, the contact offers superior conductivity and mechanical strength, enhanced with nickel plating to resist corrosion and wear.

This closed type spring contact features protected tips that prevent hooking, simplifying automated handling and insertion on PCBs using standard pick and place machinery, facilitating efficient chassis assembly and grounding control.

Rated for a current of 4A, it is suitable for low power electronic circuits requiring effective grounding to reduce electromagnetic interference (EMC) and static discharge. The compact size - 6 mm height, 4 mm length, and 2.5 mm width - allows integration in dense PCB layouts, ideal for ESD control and cleanroom environments.

The robust design ensures reliable connection of multiple printed circuit boards, enhancing overall system integrity. These features make it indispensable for electronic manufacturing, PCB prototyping, and power connector applications across diverse industries including consumer electronics, communications, and industrial automation.

Constructed from titanium copper alloy for durability. Nickel plated contacts provide corrosion resistance. Surface mount fixing method for efficient PCB assembly. 4A current rating suitable for low power circuits. Protected closed tip design prevents hooking during placement.

Compatible with automated pick and place equipment. Compact 6 mm height ensures space-efficient design. Effective grounding for EMI/ESD noise mitigation. Explore the full range of Grounding Contacts on EnvMart to optimize your electronic component installations and ensure robust EMC compliance.

HARWIN 6 mm Surface Mount Titanium Copper Alloy Spring Contact S7051-42R
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Frequently Asked Questions

The HARWIN S7051-42R spring contact is rated for a current of 4A, making it suitable for low power electronic circuits.

This model is constructed from titanium copper alloy, which provides high conductivity and mechanical strength.

The dimensions of the S7051-42R are 6 mm in height, 4 mm in length, and 2.5 mm in width.

The spring contact is designed for effective grounding, which helps reduce electromagnetic interference (EMI) and static discharge across multiple PCBs.

It uses a surface mount fixing method, which ensures efficient assembly on printed circuit boards (PCBs).

The contact is nickel plated, providing excellent corrosion resistance and wear protection.

Yes, it is compatible with standard pick and place equipment, facilitating automated handling and insertion during manufacturing.

The spring contact features protected tips that prevent hooking during installation, simplifying the assembly process.

This model is effective in industrial and manufacturing environments, particularly for electronic grounding applications.

It is suitable for electronic manufacturing, PCB prototyping, and power connector applications across various industries including consumer electronics and communications.

The country of origin for this product is India.

Its compact size allows for integration in dense PCB layouts, making it ideal for applications requiring space efficiency.

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