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HARWIN 3.85 mm Beryllium Copper Alloy Surface Mount Grounding Contact S1711-46R
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | HARWIN |
| Material | Beryllium Copper Alloy |
| Height | 3.85mm |
| Length | 8.79mm |
| Model | S1711-46R |
| Width | 2.28mm |
| Contact Resistance | 20mΩ |
| Contact Plating | Tin |
| Fixing Method | Surface Mount |
Key Features
- Manufactured from beryllium copper alloy ensuring durability and excellent conductivity.
- Surface mount fixing method allows for efficient PCB assembly.
- Contact resistance rated at 20 milliohms ensuring minimal signal loss.
- Contact plating finished with tin for corrosion resistance.
- Compact dimensions of 3.85 mm height, 8.79 mm length, and 2.28 mm width optimize space on PCBs.
- Designed as an EZ-BoardWare SMT RFI shield clip for quick assembly of shielding cans.
- Supports a range of shield thicknesses from 0.17 to 0.3 mm.
- Enables easy removal of RFI shield cans for maintenance without soldering.
Product Description
HARWIN S1711-46R grounding contact is a precision-engineered surface mount component fabricated from high-quality beryllium copper alloy with tin plating. Measuring 3.85 mm in height, 8.79 mm in length, and 2.28 mm in width, this grounding contact is designed to ensure low contact resistance of 20 milliohms, making it highly efficient for grounding applications in electronic assemblies.
This component serves as an EZ-BoardWare SMT RFI shield clip, providing a fast and space-saving method to mount RFI shield cans onto printed circuit boards (PCBs). The surface mount fixing method avoids the need for direct soldering, significantly reducing PCB assembly time and cost.
Its tin-plated contacts offer corrosion resistance while maintaining excellent electrical conductivity. The clip design supports shield thicknesses ranging from 0.17 to 0.3 mm, enabling compatibility with a wide variety of shielding solutions.
In industrial settings such as electronics manufacturing, laboratory prototyping, and telecommunication equipment production, the HARWIN grounding contact enhances electromagnetic interference (EMI) control by maintaining reliable grounding pathways and facilitating easy removal of shielding cans for maintenance or repair.
Manufactured from beryllium copper alloy ensuring durability and excellent conductivity. Surface mount fixing method allows for efficient PCB assembly. Contact resistance rated at 20 milliohms ensuring minimal signal loss.
Contact plating finished with tin for corrosion resistance. Compact dimensions suitable for space-constrained PCB layouts. Supports shield thicknesses from 0.17 to 0.3 mm. Allows easy removal of RFI shield cans without soldering.
Produced in the United Kingdom to stringent quality standards. Ideal for industrial use in electronics manufacturing and prototyping.
Choose HARWIN Grounding Contacts for reliable EMI shielding and efficient PCB production workflows. Browse our extensive catalog of grounding and electronic components for comprehensive industrial solutions.
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Frequently Asked Questions
The contact resistance is rated at 20 milliohms, ensuring minimal signal loss in grounding applications.
It is manufactured from beryllium copper alloy, which provides excellent conductivity and durability.
This model has a height of 3.85 mm, a length of 8.79 mm, and a width of 2.28 mm, making it compact for PCB layouts.
The surface mount fixing method allows for efficient PCB assembly by avoiding the need for direct soldering, which reduces assembly time and costs.
The contacts are finished with tin plating, which provides corrosion resistance while maintaining electrical conductivity.
It supports shield thicknesses ranging from 0.17 mm to 0.3 mm, making it compatible with various shielding solutions.
It is produced in the United Kingdom to stringent quality standards.
It is designed as an EZ-BoardWare SMT RFI shield clip, facilitating quick assembly of shielding cans onto printed circuit boards.
It is suitable for use in electronics manufacturing, laboratory prototyping, and telecommunication equipment production, enhancing EMI control.
It enhances electromagnetic interference (EMI) control by maintaining reliable grounding pathways and enabling easy removal of shielding cans for maintenance.
It allows for easy removal of RFI shield cans without soldering, simplifying maintenance and repair processes.
They provide reliable EMI shielding and improve efficiency in PCB production workflows due to their quick assembly features.
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