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HARWIN 1.7 mm Titanium Copper Alloy Surface Mount Grounding Contact S7121-42R
Specifications
| Country of Origin | India |
|---|---|
| Brand | HARWIN |
| Material | Titanium Copper Alloy |
| Current | 4A |
| Height | 1.7mm |
| Length | 2.7mm |
| Model | S7121-42R |
| Width | 1.5mm |
| Contact Plating | Gold |
| Fixing Method | Surface Mount |
| HARWIN 1.7mm Spring ContactBrand | HARWIN |
Key Features
- Fabricated from titanium copper alloy ensuring durability and reliable conductivity.
- Features gold plating for enhanced corrosion resistance and conductivity.
- Surface mount fixing method allows for automated placement on PCBs.
- Designed to handle a current capacity of 4A efficiently.
- Compact dimensions of 1.7 mm height, 1.5 mm width, and 2.7 mm length enable use in restricted spaces.
- Ideal for use in electronic prototyping, PCB shielding, and grounding applications.
- The spring contact design ensures effective wiping and sliding contact action.
- Suitable for automated assembly using standard placement equipment.
Product Description
HARWIN S7121-42R is a 1.7 mm grounding contact composed of titanium copper alloy, with gold plating to ensure excellent electrical conductivity and corrosion resistance. The surface mount design is optimized for automated PCB assembly processes, making it ideal for high-volume manufacturing environments.
This grounding contact features a C-style spring configuration that provides reliable wiping and sliding action to maintain positive contact with metal shields or frames. It supports a continuous current rating of 4A, suitable for typical PCB grounding and shielding requirements.
Compact dimensions (1.7 mm height, 1.5 mm width, 2.7 mm length) make this product ideal for use in tight spaces or blindmate applications where access is limited. The robust spring properties ensure consistent contact pressure and durability.
These contacts are commonly used in electronic components prototyping, point-of-sale terminals, home entertainment systems, instrument panels, industrial process control equipment, motion control units, and mobile power devices. They are well-suited for applications requiring reliable grounding and EMI/RFI shielding.
Fabricated from titanium copper alloy for optimal strength and performance. Gold plating enhances conductivity and corrosion resistance. Surface mount fixing allows for automated placement on PCBs. Support for 4A current capacity.
Compact size fits into restricted application spaces. Reliable spring contact mechanism for wiping and sliding actions. Applicable across industrial, commercial, and laboratory electronics uses. Choose HARWIN Grounding Contacts from EnvMart for reliable grounding and EMI control solutions in electronics manufacturing and prototyping.
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Frequently Asked Questions
This model has a continuous current rating of 4A, making it suitable for typical PCB grounding and shielding requirements.
The HARWIN S7121-42R has compact dimensions of 1.7 mm in height, 1.5 mm in width, and 2.7 mm in length, allowing it to fit into restricted spaces.
It is fabricated from titanium copper alloy, which ensures durability and reliable conductivity.
This grounding contact uses a surface mount fixing method, which allows for automated placement during PCB assembly.
It features gold plating, which enhances both conductivity and corrosion resistance.
This model is ideal for electronic prototyping, PCB shielding, and grounding applications, as well as use in point-of-sale terminals and home entertainment systems.
It features a C-style spring contact design that provides reliable wiping and sliding action to maintain positive contact with metal shields or frames.
The country of origin for this grounding contact is India.
Yes, its surface mount design is optimized for automated assembly using standard placement equipment, making it suitable for high-volume manufacturing.
Its compact size allows it to be used in tight spaces or blindmate applications where access is limited, ensuring versatility in various electronic designs.
This grounding contact is commonly used in industrial process control equipment, motion control units, and mobile power devices, among others.
The spring contact mechanism is designed to ensure consistent contact pressure and durability, which is essential for reliable grounding and EMI/RFI shielding.
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