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HARWIN 1.23 mm Ultra Low Profile SMT Spring Contact Titanium Copper Alloy Gold Plated S7221-45R

Category Grounding Contacts Brand HARWIN Condition New

Specifications

Country of Origin Korea
Brand HARWIN
Material Titanium Copper Alloy
Current 1A
Height 1.23mm
Length 2.6mm
Model S7221-45R
Width 1mm
Contact Resistance 50mΩ
Contact Plating Gold
Fixing Method Surface Mount

Key Features

  • Constructed from titanium copper alloy for excellent conductivity and durability.
  • Gold plating provides reliable contact corrosion resistance.
  • Surface mount fixing method for ease of automated placement.
  • Contact resistance rated at 50 milliohms ensuring low signal loss.
  • Supports current up to 1 ampere for various electronic applications.
  • Positive stop shoulder prevents over compression and maintains spring force.
  • Protected tip design to avoid hooking during handling and operation.
  • Suitable for wiping and sliding actions in antenna feed and RFID devices.

Product Description

HARWIN S7221-45R spring contact is an ultra low profile SMT antenna spring contact tailored for high precision electronic components. It measures 1.23 mm in height, 2.6 mm in length, and 1 mm in width, crafted from titanium copper alloy with gold plating to ensure durable and reliable conductivity.

Designed for surface mount fixing method, this spring contact supports automated pick-and-place assembly processes commonly used in manufacturing mobile device antenna feeds, LED lamp connections, and RFID tags.

The contact resistance is rated at 50 milliohms, supporting currents up to 1 ampere, making it suitable for low power signal transfer applications. Its positive stop shoulder prevents over-compression, thus preserving the spring's mechanical properties and force consistency.

The protected tip design helps to prevent hooking during handling or operation, improving reliability in wiping and sliding applications. The ultra low profile and compact dimensions make it ideal for integration in confined spaces on printed circuit boards.

Constructed from titanium copper alloy providing robustness and excellent electrical conductivity. Gold plated contacts ensure corrosion resistance and high reliability. Surface mount fixing method facilitates efficient automated PCB integration.

Low contact resistance of 50 milliohms reduces signal loss effectively. Current rating of 1 ampere suits a variety of electronic component needs. Positive stop feature prevents over-compression and damage to the contact spring.

Protected tip helps avoid mechanical damage during application and usage. Designed for wiping and sliding actions common in antenna and sensor applications. Compact form factor enables integration into miniature electronic devices.

This HARWIN spring contact is suitable for industrial electronics manufacturing, laboratory prototype assembly, mobile device production, and other electronic component bonding applications requiring durable, low-profile spring contacts.

Explore more electronics components and Grounding Contacts in the Electronics & Electricals category on EnvMart.

HARWIN 1.23 mm Ultra Low Profile SMT Spring Contact Titanium Copper Alloy Gold Plated S7221-45R
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