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HARWIN 3.85 mm Grounding Contact Surface Mount Beryllium Copper Alloy Tin Plating S1711-46R
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | HARWIN |
| Material | Beryllium Copper Alloy |
| Height | 3.85mm |
| Length | 8.79mm |
| Model | S1711-46R |
| Width | 2.28mm |
| Contact Resistance | 20mΩ |
| Contact Plating | Tin |
| Fixing Method | Surface Mount |
Key Features
- This grounding contact offers a contact resistance of 20 milliohms.
- It features a length of 8.79 mm and a width of 2.28 mm.
- Manufactured in the United Kingdom ensuring quality and reliability.
- Surface mount fixing method reduces PCB assembly costs and improves maintenance.
- Suitable for applications requiring reliable RFI shielding and grounding on PCBs.
Product Description
HARWIN S1711-46R grounding contact is a 3.85 mm high surface mount device made from beryllium copper alloy with tin plating. Designed as part of the Harwin EZ Boardware SMT RFI shield clips, it provides an efficient solution for assembling RFI shield cans to printed circuit boards without the need for direct soldering. This reduces PCB assembly costs and enables easy removal for repair and maintenance.
The contact resistance is low at 20 milliohms, ensuring effective grounding and shielding performance. It measures 8.79 mm in length and 2.28 mm in width, fitting various shield thicknesses between 0.17 and 0.3 mm. Manufactured in the United Kingdom, this grounding contact complies with high manufacturing quality standards.
These SMT shield clips are widely used in electronic components, power and connectors assemblies, and PCB prototyping applications to control electromagnetic interference and improve device reliability. The tin plating enhances conductivity and corrosion resistance, making it suitable for industrial, laboratory, automation, and manufacturing environments.
Low contact resistance of 20 mΩ for efficient grounding. Compact surface mount design with 3.85 mm height and precise dimensions. Beryllium copper alloy material ensures excellent conductivity and strength. Tin plating for corrosion resistance and reliability in harsh conditions.
Easy installation and removal for PCB assembly and maintenance. Explore the wide range of Grounding Contacts and electronic components on EnvMart for industrial, laboratory, and commercial applications.
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Frequently Asked Questions
The contact resistance of this grounding contact is 20 milliohms, ensuring effective grounding performance.
It measures 8.79 mm in length, 2.28 mm in width, and has a height of 3.85 mm.
This grounding contact is made from beryllium copper alloy, which provides excellent conductivity and strength.
It uses a surface mount fixing method, which reduces PCB assembly costs and allows for easy removal for maintenance.
The contact features tin plating, which enhances conductivity and provides corrosion resistance.
It fits various shield thicknesses between 0.17 mm and 0.3 mm.
It is manufactured in the United Kingdom, ensuring adherence to high manufacturing quality standards.
It is widely used in electronic components, power and connectors assemblies, and PCB prototyping to control electromagnetic interference.
The height of this grounding contact is 3.85 mm.
The surface mount design reduces PCB assembly costs and allows for easy removal and maintenance of the grounding contact.
It is suitable for industrial, laboratory, automation, and manufacturing environments due to its reliable performance.
Yes, it is part of the Harwin EZ Boardware SMT RFI shield clips, designed for efficient assembly of RFI shield cans to PCBs.
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