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HARWIN 3.85 mm Surface Mount Grounding Contact Copper Nickel Material Tin Plating S2711-46R
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | HARWIN |
| Material | Copper Nickel |
| Height | 3.85mm |
| Length | 8.79mm |
| Model | S2711-46R |
| Width | 2.28mm |
| Contact Resistance | 20mΩ |
| Contact Plating | Tin |
| Fixing Method | Surface Mount |
Key Features
- Constructed from durable copper nickel material ensuring reliable conductivity.
- Features tin plating for enhanced corrosion resistance.
- Designed to fit shield cans with thickness between 0.17 and 0.3 mm.
- Compact dimensions of 8.79 mm length and 2.28 mm width optimize PCB space.
- Offers low contact resistance of 20 mΩ ensuring efficient grounding.
- Manufactured in the United Kingdom with high-quality standards.
- Enables easy assembly of RFI shield cans without soldering directly to the PCB.
- Facilitates quick removal and maintenance of the shield can when needed.
Product Description
HARWIN S2711-46R is a precision 3.85 mm high grounding contact designed for surface mount applications in high-performance electronic assemblies. Constructed from copper nickel material with tin plating, this grounding contact offers excellent electrical conductivity and corrosion resistance suited for industrial and commercial electronics manufacturing.
This grounding contact is specifically designed to support RFI shield cans of thickness ranging from 0.17 mm to 0.3 mm, enabling fast and efficient assembly without the need to solder the shield cans directly onto the PCB. This reduces assembly time and cost, while also allowing easy removal for maintenance or repair.
With compact dimensions measuring 8.79 mm in length and 2.28 mm in width, the S2711-46R grounding contact is ideal for space-constrained PCB layouts. Its low contact resistance of 20 milliohms ensures effective grounding performance, critical in sensitive electronic and telecommunications equipment to reduce electromagnetic interference (EMI).
Manufactured in the United Kingdom, this grounding contact adheres to stringent quality controls and builds reliability for use in electronics, power connectors, ESD control, and prototyping board applications across a variety of industry sectors including industrial automation, electronics manufacturing, and telecommunications.
This product is part of Harwin's EZ BoardWare SMT RFI Shield Clips range, which provides solutions for fast assembling of RFI shields to PCBs, reducing production costs and enabling effective EMI control.
Durable copper nickel construction with tin plating. Surface mount fixing method for easy PCB integration. Low contact resistance of 20 mΩ for efficient grounding. Compact size optimizes PCB footprint with 3.85 mm height.
Facilitates removable RFI shield cans for maintenance. Manufactured to high standards in the United Kingdom. For efficient procurement and quality components, browse our full range of Grounding Contacts with trusted brands at EnvMart.
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Frequently Asked Questions
The contact resistance of this grounding contact is 20 milliohms, ensuring efficient grounding performance.
It is constructed from copper nickel material and features tin plating for enhanced corrosion resistance.
This model has a length of 8.79 mm, a width of 2.28 mm, and a height of 3.85 mm, making it compact for PCB layouts.
The HARWIN S2711-46R uses a surface mount fixing method for easy integration onto PCBs.
It is designed to fit shield cans with a thickness ranging from 0.17 mm to 0.3 mm.
This grounding contact is manufactured in the United Kingdom, adhering to high-quality standards.
It is suitable for use in electronics manufacturing, telecommunications, and industrial automation applications.
It allows for the easy removal of RFI shield cans, enabling maintenance or repair without soldering directly to the PCB.
The tin plating enhances corrosion resistance, contributing to the reliability of the grounding contact in various applications.
The low contact resistance of 20 mΩ is critical for effective grounding, particularly in sensitive electronic and telecommunications equipment.
It is part of Harwin's EZ BoardWare SMT RFI Shield Clips range, designed for fast assembly of RFI shields to PCBs.
The surface mount design reduces assembly time and costs, allowing for efficient production processes in electronic assemblies.
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