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HARWIN 2.23 mm Grounding Contact Surface Mount Beryllium Copper Alloy Tin Plating S1721-46R
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | HARWIN |
| Material | Beryllium Copper Alloy |
| Height | 2.23mm |
| Length | 5.08mm |
| Model | S1721-46R |
| Width | 1.07mm |
| Contact Resistance | 40mΩ |
| Contact Plating | Tin |
| Fixing Method | Surface Mount |
Key Features
- Constructed from high-quality beryllium copper alloy for excellent elasticity and conductivity.
- Surface mount fixing method enables space saving on printed circuit boards.
- Tin plating enhances corrosion resistance and electrical contact durability.
- Low contact resistance rated at 40 milliohms for reliable grounding performance.
- Compact dimensions of 5.08 mm length and 1.07 mm width fit various shield can designs.
- Manufactured to no specific standards or approvals, designed for general industrial use.
- Originates from the United Kingdom, ensuring high manufacturing quality and consistency.
- Ideal for assembling RFI shield cans to PCBs without soldering, reducing assembly costs.
Product Description
HARWIN S1721-46R is a grounding contact designed for surface mount technology applications, measuring 2.23 mm in height, constructed from beryllium copper alloy with tin plating for enhanced conductivity and corrosion resistance.
This component is widely used in industrial electronic and electrical applications involving ESD control, cleanroom environments, and PCB prototyping. The grounding contact's dimensions - 5.08 mm length, 1.07 mm width, and 2.23 mm height - make it suitable for compact electronic assemblies.
The product serves as an EZ Boardware SMT RFI Shield Clip allowing rapid assembly of RFI shield cans on PCBs without direct soldering. This design reduces production costs and facilitates shield can removal for maintenance or repair, enhancing operational efficiency.
Its contact resistance is low, at 40 mΩ, securing effective grounding and minimizing signal disruption. The tin plating adds a protective layer, improving lifespan and performance in challenging industrial environments.
High-quality beryllium copper alloy construction ensuring elasticity and conductivity. Surface mount fixing method conserves PCB space and simplifies installation. Designed to fit shield cans with thickness from 0.13 to 0.23 mm.
Durable tin plating offers corrosion resistance and maintains electrical integrity. Low contact resistance supports reliable grounding functions in sensitive electronics. Compact physical dimensions enable use in densely packed PCB assemblies.
Manufactured in the United Kingdom, guaranteeing stringent quality standards. Enables easy assembly and removal of RFI shield cans, reducing assembly time and maintenance effort. Widely applicable in industrial, laboratory, and manufacturing electronic prototyping scenarios.
Supports improvements in ESD control and electromagnetic shielding in electronic systems.
This HARWIN grounding contact is an essential component for engineers and technicians engaged in electronic design, assembly, and maintenance within power connectors, prototyping boards, and cleanroom environments. Browse EnvMart's Electronics Components category for more grounding and connector solutions.
Explore more products in our Grounding Contacts category.
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Frequently Asked Questions
The contact resistance is rated at 40 milliohms, ensuring reliable grounding performance.
It is constructed from beryllium copper alloy, which provides excellent elasticity and conductivity, and features tin plating for enhanced corrosion resistance.
The dimensions are 5.08 mm in length, 1.07 mm in width, and 2.23 mm in height, making it suitable for compact electronic assemblies.
The surface mount fixing method conserves PCB space and simplifies installation, allowing for rapid assembly of RFI shield cans without soldering.
It is widely used in industrial electronic and electrical applications, particularly in ESD control, cleanroom environments, and PCB prototyping.
The tin plating enhances corrosion resistance and improves the electrical contact durability, contributing to the component's overall performance.
This model is designed for assembling RFI shield cans to PCBs, facilitating easy assembly and removal while reducing production costs.
The HARWIN S1721-46R is manufactured in the United Kingdom, ensuring high manufacturing quality and consistency.
It is designed to fit shield cans with a thickness ranging from 0.13 mm to 0.23 mm.
It supports improvements in ESD control and electromagnetic shielding, making it essential for engineers and technicians in electronic design and assembly.
This grounding contact is manufactured to no specific standards or approvals, and is designed for general industrial use.
The low contact resistance of 40 mΩ ensures effective grounding and minimizes signal disruption in sensitive electronic systems.
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