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HARWIN 5.5 mm Titanium Copper Alloy Surface Mount Grounding Contact Gold Plated Current 4A S7061-42R

Category Grounding Contacts Brand HARWIN Condition New

Specifications

Country of Origin India
Brand HARWIN
Material Titanium Copper Alloy
Current 4A
Height 5.5mm
Length 7mm
Model S7061-42R
Width 2.5mm
Contact Plating Gold
Fixing Method Surface Mount

Key Features

  • Constructed from durable titanium copper alloy for long-term performance.
  • Gold plating ensures excellent conductivity and corrosion resistance.
  • Designed for surface mount PCB installation with precise dimensions.
  • Supports a current rating of 4 amperes for efficient grounding.
  • Compact size suitable for automated placement and restricted spaces.
  • Ideal for applications requiring wiping and sliding contact action.
  • Effective in RFI shielding and reliable grounding in electronic devices.
  • Compatible with standard placement equipment for mass production.

Product Description

HARWIN S7061-42R grounding contact is a precision-engineered surface mount component made of titanium copper alloy with gold plating, measuring 5.5 mm in height, 7 mm length, and 2.5 mm width. It is designed for use on PCBs where reliable grounding and RFI shielding are critical, especially in compact and blindmate applications.

This grounding contact provides excellent spring properties and contact reliability through its EZ-BoardWare C-style spring design, facilitating both wiping and sliding contact motions. It supports currents up to 4 amperes, making it suitable for high-performance electronic equipment.

Manufactured to be compatible with automated pick-and-place equipment, it allows efficient high-volume PCB assembly. The gold-plated contact surface ensures minimal resistance and durability in harsh electrical environments.

Typical industrial applications include point-of-sale tracking systems, home entertainment electronics, instrument panels, industrial process controls, and motion control units. This component enhances EMI/RFI shielding and grounding for improved electrical performance and device safety.

Key features include surface mount fixing, robust titanium copper alloy construction, gold plating for conductivity, and suitability for automated manufacturing processes. The small size and reliable contact make it ideal for use where available space is limited and reliable grounding is essential.

Constructed from durable titanium copper alloy for long-term performance. Gold plating ensures excellent conductivity and corrosion resistance. Designed for surface mount PCB installation with precise dimensions. Supports a current rating of 4 amperes for efficient grounding.

Compact size suitable for automated placement and restricted spaces. Ideal for applications requiring wiping and sliding contact action. Effective in RFI shielding and reliable grounding in electronic devices. Compatible with standard placement equipment for mass production.

Explore more Grounding Contacts and related electronic components at EnvMart for your industrial, laboratory, and manufacturing needs.

HARWIN 5.5 mm Titanium Copper Alloy Surface Mount Grounding Contact Gold Plated Current 4A S7061-42R
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