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HARWIN 5.5 mm Titanium Copper Alloy Surface Mount Grounding Contact Gold Plated Current 4A S7061-42R
Specifications
| Country of Origin | India |
|---|---|
| Brand | HARWIN |
| Material | Titanium Copper Alloy |
| Current | 4A |
| Height | 5.5mm |
| Length | 7mm |
| Model | S7061-42R |
| Width | 2.5mm |
| Contact Plating | Gold |
| Fixing Method | Surface Mount |
Key Features
- Constructed from durable titanium copper alloy for long-term performance.
- Gold plating ensures excellent conductivity and corrosion resistance.
- Designed for surface mount PCB installation with precise dimensions.
- Supports a current rating of 4 amperes for efficient grounding.
- Compact size suitable for automated placement and restricted spaces.
- Ideal for applications requiring wiping and sliding contact action.
- Effective in RFI shielding and reliable grounding in electronic devices.
- Compatible with standard placement equipment for mass production.
Product Description
HARWIN S7061-42R grounding contact is a precision-engineered surface mount component made of titanium copper alloy with gold plating, measuring 5.5 mm in height, 7 mm length, and 2.5 mm width. It is designed for use on PCBs where reliable grounding and RFI shielding are critical, especially in compact and blindmate applications.
This grounding contact provides excellent spring properties and contact reliability through its EZ-BoardWare C-style spring design, facilitating both wiping and sliding contact motions. It supports currents up to 4 amperes, making it suitable for high-performance electronic equipment.
Manufactured to be compatible with automated pick-and-place equipment, it allows efficient high-volume PCB assembly. The gold-plated contact surface ensures minimal resistance and durability in harsh electrical environments.
Typical industrial applications include point-of-sale tracking systems, home entertainment electronics, instrument panels, industrial process controls, and motion control units. This component enhances EMI/RFI shielding and grounding for improved electrical performance and device safety.
Key features include surface mount fixing, robust titanium copper alloy construction, gold plating for conductivity, and suitability for automated manufacturing processes. The small size and reliable contact make it ideal for use where available space is limited and reliable grounding is essential.
Constructed from durable titanium copper alloy for long-term performance. Gold plating ensures excellent conductivity and corrosion resistance. Designed for surface mount PCB installation with precise dimensions. Supports a current rating of 4 amperes for efficient grounding.
Compact size suitable for automated placement and restricted spaces. Ideal for applications requiring wiping and sliding contact action. Effective in RFI shielding and reliable grounding in electronic devices. Compatible with standard placement equipment for mass production.
Explore more Grounding Contacts and related electronic components at EnvMart for your industrial, laboratory, and manufacturing needs.
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Frequently Asked Questions
This model supports a current rating of 4 amperes, making it suitable for high-performance electronic equipment.
The grounding contact measures 5.5 mm in height, 7 mm in length, and 2.5 mm in width.
It is constructed from a titanium copper alloy, which provides durability and long-term performance.
The contact surface is gold plated, ensuring excellent conductivity and corrosion resistance.
It is designed for surface mount installation on PCBs, facilitating efficient assembly.
Typical applications include point-of-sale tracking systems, home entertainment electronics, instrument panels, industrial process controls, and motion control units.
Yes, this model is compatible with standard placement equipment for mass production, allowing for efficient high-volume PCB assembly.
This design enhances contact reliability and facilitates both wiping and sliding contact motions, improving performance in critical applications.
The grounding contact is manufactured in India.
It effectively enhances EMI/RFI shielding and grounding, improving electrical performance and device safety in electronic devices.
The compact size makes it suitable for automated placement and use in restricted spaces, where reliable grounding is essential.
Key features include robust titanium copper alloy construction, gold plating for conductivity, and a design that supports wiping and sliding contact actions.
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