Samtec SSQ Series Through Hole 4-Contact 2 Row 2.54 mm Pitch PCB Socket SSQ-102-03-T-D

Samtec SSQ-102-03-T-D is a high-quality PCB socket from the SSQ series designed for through hole mounting in electronic assemblies. This 4-contact, 2-row socket features a 2.54 mm pitch and is made with a robust liquid crystal polymer housing that provides excellent durability and insulation.

The contacts are constructed from phosphor bronze and plated with tin to ensure reliable electrical conductivity and corrosion resistance. Suitable for board-to-board connector systems, it handles currents up to 6.3 A per pin when 2 pins are powered, and it supports voltage ratings of up to 655 V DC and 465 V AC.

This PCB socket operates efficiently across a wide temperature range from -55°C to 105°C, making it ideal for various industrial and electronic applications, including telecommunications, instrumentation, and control systems. The solder termination type and through hole mount make it compatible with standard PCB assembly processes.

The socket includes features such as a standard normal force of 125 grams and a maximum of 100 mating cycles with a gold plating thickness of 0.25 μm, enhancing connection reliability over repeated cycles. The straight orientation and female contact gender facilitate straightforward integration into electronic designs.

Constructed with liquid crystal polymer housing for durability. Phosphor bronze contacts with tin plating ensure reliable electrical conductivity. Rated for 6.3 A current and 655 V voltage for robust power handling. Features a solder termination type suitable for through hole mounting.

Operates within a temperature range from -55°C to 105°C for versatile environment use. Standard contact normal force of 125 grams provides secure connection. Max cycle life of 100 with gold plating thickness of 0.25 μm ensures longevity.

Designed with a straight orientation and female contact gender for ease of installation.

This PCB socket is suitable for use in industrial, electronic manufacturing, telecommunications, and testing environments requiring reliable board-to-board connectivity and high current handling capabilities.

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