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STMicroelectronics 3-Element TVS Diode Surface Mount SOIC Package 28 V, 200 A TPN3021RL

Category TVS Diode Brand STMicroelectronics Condition New

Specifications

Country of Origin India
Brand STMicroelectronics
Height 1.5mm
Length 5mm
Model TPN3021RL
Width 4mm
Mount Type Surface
Maximum Operating Temperature 150°C
Package Type SOIC
Minimum Operating Temperature -40°C
Pin Count 8
Number of Elements per Chip 3
Maximum Reverse Stand-off Voltage Vwm 28V
Maximum Peak Pulse Current Ippm 200A
Maximum Reverse Leakage Current 4μA

Key Features

  • Provides robust transient voltage suppression with a 28 V maximum reverse stand-off voltage.
  • Features 3 elements per chip ensuring effective multi-line protection.
  • High peak pulse current capability of 200 A for lightning surge protection.
  • Compact SOIC package with 8 pins suitable for PCB surface mounting.
  • Operating temperature range from -40°C to 150°C for reliable performance in harsh environments.
  • Low capacitance design optimized for high debit rate communication networks.
  • Maximum reverse leakage current is nominal at 4 μA to ensure minimal power loss.
  • Not certified to automotive standards but suitable for general electronic protection applications.

Product Description

STMicroelectronics TPN3021RL 3-Element TVS Diode is a surface mount device designed with a low capacitance transient surge arrestor optimized for protection of Ethernet and other high-speed communication lines. Encapsulated in an 8-pin SOIC package, it offers a maximum reverse stand-off voltage of 28 V and a robust peak pulse current rating of 200 A to safeguard sensitive semiconductor circuits against lightning and transient voltage surges.

Its compact dimensions (5 mm length, 4 mm width, and 1.5 mm height) and low reverse leakage current of 4 μA make it ideal for compact PCB layouts requiring efficient overvoltage protection. The diode operates reliably in a temperature range from -40°C to 150°C, ensuring durability across various industrial, commercial, and telecommunications applications.

The TPN3021RL includes three elements per chip to provide multi-line transient voltage suppression, which is crucial for protecting Ethernet lines transmitting high debit rates. Although not automotive certified, this device is trusted in general industrial and electronic equipment applications requiring transient voltage protection.

This component is supplied on reels, enabling streamlined automated PCB assembly processes for volume production. Robust transient voltage surge protection device. Low capacitance for high-speed data lines. Compact SOIC surface mount packaging.

Wide operating temperature range from -40°C to 150°C. High peak pulse current of 200 A supports lightning surge resilience. Effective for Ethernet and high-speed communication networks. Minimal reverse leakage current ensures energy efficiency.

Three diode elements provide multi-line protection per chip. Explore the Electronics & Electricals category for a wide range of semiconductor devices and protection components at EnvMart.

STMicroelectronics 3-Element TVS Diode Surface Mount SOIC Package 28 V, 200 A TPN3021RL
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Frequently Asked Questions

The maximum reverse stand-off voltage of this model is 28 V.

It has a high peak pulse current capability of 200 A, suitable for lightning surge protection.

This model has dimensions of 5 mm in length, 4 mm in width, and 1.5 mm in height.

The diode operates reliably in a temperature range from -40°C to 150°C.

There are three elements per chip, providing effective multi-line protection.

The maximum reverse leakage current is nominally 4 μA, ensuring minimal power loss.

It comes in an 8-pin SOIC package, designed for surface mounting on PCBs.

No, it is not certified to automotive standards but is suitable for general electronic protection applications.

This model is optimized for protecting Ethernet and other high-speed communication lines.

It is supplied on reels, facilitating automated PCB assembly processes for volume production.

It utilizes surface mounting, making it suitable for compact PCB layouts.

The low capacitance design is optimized for high debit rate communication networks, ensuring efficient performance.

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