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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13088RC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | W13088RC |
| Mount Type | Through Hole |
| Housing Material | Fibreglass |
| Contact Material | Brass |
| Pitch | 2.54mm |
| Connection Gender A | Female |
| Number of Contacts A | 8 |
| Connection Gender B | Male |
| Connection A | QFN |
| Connection B | DIP |
Key Features
- This adapter features a pitch of 2.54 mm suitable for through hole mounting.
- It converts Quad Flat No Lead (QFN) to Dual In Line Package (DIP) format compatibility.
- The connections include 8 contacts on both QFN (female) and DIP (male) sides.
- Constructed with brass contacts and fibreglass housing for durability.
- Designed with a straight orientation for reliable connection.
- The product is manufactured in the United Kingdom.
- Suitable for electronic applications requiring package style conversion.
- Ideal for development to avoid redesigning circuit boards for new packages.
Product Description
Winslow W13088RC IC Socket Adapter is a high-quality connector designed for converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to the Dual In Line Package (DIP) format. With a 2.54 mm pitch and through hole straight mount design, this adapter enables seamless integration of QFN ICs onto DIP-compatible circuit boards.
The adapter features 8 female contacts on the QFN side and 8 male contacts on the DIP side, allowing precise and secure connections. The contacts are made from brass, delivering excellent electrical conductivity, while the fibreglass housing ensures mechanical stability and resistance to environmental factors.
Manufactured in the United Kingdom, this product supports various electronic applications including industrial, manufacturing, laboratory, and prototyping environments. Its ‘Adaptics’ design reduces development costs by eliminating the need to redesign PCBs when switching package types.
The straight orientation and through hole mount type facilitate easy PCB integration and reliable electrical performance. This IC socket adapter is a valuable component for engineers and technicians working with multiple IC package formats.
Adapter converts QFN to DIP package format with 2.54 mm pitch. Eight contacts on both QFN (female) and DIP (male) sides. Brass contact material ensures effective conductivity. Fibreglass housing provides robustness and insulation.
Through hole straight mount suitable for PCB integration. Manufactured in the United Kingdom ensuring quality. Ideal for industrial, laboratory, manufacturing, and prototyping use cases. Helps reduce PCB redesign costs by accommodating different IC packages.
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Frequently Asked Questions
The pitch of this adapter is 2.54 mm, suitable for through hole mounting.
This model supports connections from Quad Flat No Lead (QFN) on the female side and Dual In Line Package (DIP) on the male side, with 8 contacts for each connection.
The contacts are made from brass, while the housing is constructed from fibreglass, providing mechanical stability and insulation.
It features a straight orientation, which facilitates reliable connections during PCB integration.
This product is manufactured in the United Kingdom.
The mount type for this adapter is through hole, making it suitable for PCB integration.
There are 8 contacts on both the QFN (female) side and the DIP (male) side.
This adapter is suitable for various electronic applications including industrial, manufacturing, laboratory, and prototyping environments.
The model number of this adapter is W13088RC.
The adapter is designed to convert QFN package formats to DIP format, helping to avoid PCB redesigns for new packages.
Its design helps reduce the need for redesigning circuit boards when integrating different IC package types.
The connection gender is female on the QFN side and male on the DIP side.
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