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Sunhayato Epoxy Glass Fabric Laminate Matrix Board FR4 with 0.9 mm Holes, 245 mm x 195 mm ICB-500GH
Specifications
| Country of Origin | Japan |
|---|---|
| Brand | Sunhayato |
| Length | 245mm |
| Model | ICB-500GH |
| Width | 195mm |
| Hole Diameter | 0.9mm |
| Board Material | Epoxy Glass Fabric Laminate |
| Standards/Approvals | BS EN 61340, ANSI/ESD S20 |
| Board Thickness | 1.6mm |
| FR Material Grade | FR4 |
| Copper Thickness | 18μm |
Key Features
- Constructed with durable FR4 epoxy glass fabric laminate material.
- Board thickness of 1.6 mm ensures structural integrity.
- Hole diameter of precisely 0.9 mm suitable for prototyping and circuit assembly.
- Copper thickness of 18 microns provides reliable conductivity.
- Conforms to BS EN 61340 and ANSI/ESD S20 standards for ESD control.
- Manufactured in Japan ensuring high quality and performance.
Product Description
Sunhayato ICB-500GH is a high-quality Matrix Board designed for electronics prototyping and circuit assembly applications. This Matrix Board is fabricated from FR4 epoxy glass fabric laminate material with a thickness of 1.6 mm, providing excellent mechanical strength and thermal resistance.
The board features 0.9 mm diameter holes arranged for versatile electronic component placement. Additionally, it has a copper thickness of 18 microns which ensures efficient electrical conductivity for circuit prototyping.
Measuring 245 mm in length and 195 mm in width, the board offers an ample working area compatible with various laboratory, industrial, and manufacturing environments. It meets key ESD control standards including BS EN 61340 and ANSI/ESD S20, making it suitable for sensitive electronic components assembly and testing.
Manufactured in Japan, the ICB-500GH Matrix Board assures consistent high quality and reliability for electronics professionals. Constructed with durable FR4 epoxy glass fabric laminate material. Board thickness of 1.6 mm ensures structural integrity.
Hole diameter of precisely 0.9 mm suitable for prototyping and circuit assembly. Copper thickness of 18 microns provides reliable conductivity. Conforms to BS EN 61340 and ANSI/ESD S20 standards for ESD control. Dimensions measuring 245 mm length and 195 mm width for ample workspace.
Manufactured in Japan ensuring high quality and performance.
This matrix board is ideal for industrial electronics, laboratory prototyping, manufacturing testing setups, and commercial electronics assembly processes. It enables precise and durable prototyping for circuit design and development engineers.
For further technical products and electronic components, explore the comprehensive Matrix Board collection at EnvMart.
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Frequently Asked Questions
The dimensions of this matrix board are 245 mm in length and 195 mm in width.
The board thickness of the ICB-500GH is 1.6 mm.
It is constructed from FR4 epoxy glass fabric laminate material.
The hole diameter on the ICB-500GH is 0.9 mm, suitable for prototyping and circuit assembly.
The copper thickness of this model is 18 microns, ensuring reliable conductivity.
This matrix board conforms to BS EN 61340 and ANSI/ESD S20 standards for ESD control.
It is manufactured in Japan, ensuring high quality and performance.
This model is ideal for industrial electronics, laboratory prototyping, manufacturing testing setups, and commercial electronics assembly processes.
The board features holes arranged for versatile electronic component placement, making it suitable for various components used in circuit assembly.
FR4 material grade indicates that the board has good mechanical strength and thermal resistance, making it suitable for electronic applications.
The 1.6 mm thickness provides structural integrity, making it suitable for various prototyping and assembly applications.
The combination of 0.9 mm hole diameter, 18 microns copper thickness, and compliance with ESD standards enhances its usability for circuit prototyping.
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