Yamaichi 0.65 mm Pitch 80 Way QFP Surface Test IC Socket IC51-0804-956-2

Yamaichi IC51-0804-956-2 0.65 mm Pitch 80 Way QFP Surface Test IC Socket is engineered to provide a highly reliable and precise connection solution for testing 80-pin Quad Flat Package (QFP) integrated circuits. Featuring a pitch of 0.65 mm and two rows of contacts, this surface mount test socket offers compatibility with high-density IC arrangements commonly used in industrial electronics testing, quality control, and research & development lab environments.

The socket housing is made of robust glass filled PES and PEI materials, delivering excellent thermal stability and electrical insulation suitable for operating temperatures from -55°C to 170°C. Its beryllium copper alloy contacts with gold over nickel plating ensure excellent conductivity, corrosion resistance, and longevity. The contact resistance is low at 30 milliohms under standard testing conditions, providing consistent signal integrity.

Designed with a spring loaded hinged clamshell lid, the socket efficiently retains ICs during testing and allows for quick, repeatable insertion and removal. Its surface termination type facilitates solder mounting on printed circuit boards (PCBs), ideal for integration within automated test equipment setups or bench testing stations.

This socket supports voltages up to 700 V, with insulation resistance exceeding 1000 MΩ at 500 Vdc, ensuring safe operation and minimal leakage current during high voltage tests. Durability rating of 10,000 insertions guarantees reliable performance for extended production or testing cycles.

Typical industrial use cases include manufacturing electronics testing, repair and diagnostic labs, semiconductor burn-in testing, and other critical quality assurance processes where repeatable, high fidelity IC interface is required. Its high precision and rugged build are suitable for demanding laboratory, research, and production floor applications.

The QFP test socket provides 80 contacts with a 0.65 mm pitch designed explicitly for QFP IC packages. Construction materials: glass filled PES and PEI for the body with beryllium copper alloy contacts plated with gold over nickel.

Operating temperature range from -55°C to 170°C with excellent durability of up to 10,000 insertions. Spring loaded hinged lid clamshell design for secure and repeatable IC placement during testing. Surface mount device with solder termination ensures compatibility with modern PCB manufacturing.

Electrical specifications include 700 V maximum voltage and 1000 MΩ insulation resistance at 500 Vdc. Low contact resistance of 30mΩ measured at 10mA current ensures high electrical performance. Explore EnvMart's complete collection of high quality IC Sockets and testing solutions designed for industrial electronics and laboratory precision requirements.