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Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 4 W/mK Thermal Conductivity, 100 mm x 100 mm, Silicone 40114010

Category Thermal Pads Brand Wurth Elektronik Condition New

Specifications

Country of Origin India
Brand Wurth Elektronik
Colour Purple
THICKNESS 1mm
Length 100mm
Model 40114010
Width 100mm
Series WE-TGF
Maximum Operating Temperature 180°C
Hardness 35 Shore C
Thermal Conductivity 4W/mK
Minimum Operating Temperature -50°C
Trade Name Würth Elektronik eiSos GmbH & Co. KG
Conductive Material Silicone with Ceramic Particles

Key Features

  • Thermal interface material designed to fill air gaps and uneven surfaces.
  • Thickness of 1 mm ensures optimal thermal bridging.
  • Silicone with ceramic particles provides durable thermal conductivity.
  • Operating temperature range from -50°C to +180°C for versatile use.
  • Halogen free and RoHS compliant ensuring environmental safety.
  • Hardness rated at 35 Shore C for reliable mechanical stability.
  • Suitable for electronics, HVAC, and thermal management applications.

Product Description

Wurth Elektronik 40114010 WE-TGF Series Thermal Gap Pad is a high-performance thermal interface material designed for efficient heat dissipation in electronic devices. This pad, 1 mm thick with a thermal conductivity of 4 W/mK, bridges the gap between heat-generating components and heat sinks, overcoming challenges posed by air gaps, surface roughness, and uneven topography.

Made from silicone embedded with ceramic particles, it exhibits excellent thermal conductivity and mechanical durability. Its dimensions of 100 mm by 100 mm make it suitable for a broad range of industrial and electronic cooling applications.

The thermal gap pad operates safely across a broad temperature range from -50°C to 180°C, providing reliable performance in demanding environments. It holds a hardness level of 35 Shore C, offering a balance between softness for surface conformity and firmness for structural support.

It complies with major environmental standards including Halogen Free (JEDEC JS709B), REACh ((EC) 1907/2006) and RoHS (2011/65/EU & 2015/863), ensuring it meets stringent regulatory and environmental safety requirements.

Thermal interface material designed to optimize heat transfer performance. Thickness of 1 mm suitable for standard gap filling. Silicone with ceramic particles offers enhanced thermal conductivity. Dimensions of 100 mm length and width for versatile application.

Operating temperature from -50°C to +180°C supports various industrial uses. Halogen free and RoHS compliant meeting environmental standards. Hardness rating of 35 Shore C for durability. Ideal for HVAC, electronics manufacturing, and thermal management systems.

This thermal pad is critical for applications in industrial machines, electronics manufacturing, and HVAC systems where efficient thermal management maximizes component lifespan and performance. Wurth Elektronik’s WE-TGF series is a reliable choice for engineers seeking quality and regulatory compliance.

Discover more in the Thermal Pads category and explore Wurth Elektronik’s range for advanced thermal management solutions.

Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 4 W/mK Thermal Conductivity, 100 mm x 100 mm, Silicone 40114010
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Frequently Asked Questions

The thickness of this thermal gap pad is 1 mm, which is suitable for standard gap filling applications.

The pad measures 100 mm in length and 100 mm in width, making it versatile for various applications.

It has a thermal conductivity of 4 W/mK, which enhances its efficiency in heat dissipation.

The thermal gap pad operates safely within a temperature range of -50°C to 180°C.

This model is made from silicone embedded with ceramic particles, providing enhanced thermal conductivity and durability.

It has a hardness rating of 35 Shore C, offering a balance of softness for surface conformity and firmness for structural support.

Yes, it is halogen free and complies with RoHS and REACh regulations, ensuring it meets stringent environmental safety requirements.

It is suitable for applications in electronics manufacturing, HVAC systems, and other thermal management systems.

The country of origin for this thermal gap pad is India.

The thermal gap pad is purple in color.

This thermal interface material is designed to fill air gaps and uneven surfaces, optimizing heat transfer performance between components and heat sinks.

This model is part of the WE-TGF series by Wurth Elektronik.

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