Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 3 W/mK Thermal Conductivity, 100 mm x 100 mm, Silicone 40113010

Wurth Elektronik 40113010 Thermal Gap Pad is a high-quality thermal interface material designed to optimize heat transfer between electronic components and heatsinks. This thermal gap pad is 1 mm thick and features a thermal conductivity of 3 W/mK, allowing efficient dissipation of heat in demanding electronic applications.

Manufactured using silicone embedded with ceramic particles, the pad provides excellent mechanical compliance with a hardness of 35 Shore C, making it suitable to fill irregular surfaces and gaps where traditional thermal greases are inadequate. Measuring 100 mm by 100 mm, it covers a substantial surface area to ensure uniform thermal conduction.

The pad is designed to operate within a wide temperature range from -50°C to +180°C, making it suitable for industrial electronics, HVAC systems, and other thermal management applications where robustness over varying environmental conditions is required.

Its blue coloration aids in visual inspection and differentiation from other thermal interface materials. The thermal gap pad meets important environmental standards including RoHS compliance, REACh approval, and halogen-free certifications per IEC 61249-2-21 and JEDEC JS709B, ensuring environmentally responsible use.

These features make the Wurth Elektronik WE-TGF Thermal Gap Pad ideal for bridging thermal gaps due to rough surface textures or uneven component topographies, providing reliable thermal conduction in industrial, electronic manufacturing, and HVAC thermal management systems.

Constructed from silicone with ceramic particles for enhanced thermal conduction. Dimensions measure 100 mm by 100 mm ensuring broad coverage. Hardness rated at 35 Shore C for stable mechanical compliance. Operates reliably within temperature range of -50°C to 180°C.

Blue colored pad maintains thermal performance and easy identification. Complies with RoHS and REACh for environmental safety. Ideal for bridging thermal gaps between heatsinks and electronic components. Series WE-TGF benefits include halogen-free composition certified by IEC and JEDEC standards.

Explore more thermal interface materials and Thermal Pads from Wurth Elektronik and other top brands in the EnvMart Electronics Components category for solutions tailored to your thermal management needs.