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Wurth Elektronik WE-TGF Series Thermal Gap Pad, 3 mm Thick, 5 W/mK Thermal Conductivity, 100 mm x 100 mm Ceramic 40015030

Category Thermal Pads Brand Wurth Elektronik Condition New

Specifications

Country of Origin India
Brand Wurth Elektronik
Colour White
THICKNESS 3mm
Length 100mm
Model 40015030
Width 100mm
Series WE-TGF
Maximum Operating Temperature 150°C
Hardness 35 Shore C
Thermal Conductivity 5W/mK
Minimum Operating Temperature -50°C
Trade Name WE-TGF
Conductive Material Ceramic Filled Silicone Rubber

Key Features

  • The pad is made of ceramic filled silicone rubber for effective thermal conductivity.
  • It has a hardness of 35 Shore C ensuring a balance of flexibility and durability.
  • Operates reliably within a temperature range of -50°C to 150°C.
  • Complies with RoHS, REACh, and halogen-free standards for safety and environmental compatibility.
  • Ideal for filling air gaps and uneven surfaces in electronic device heat dissipation applications.
  • Series WE-TGF ensures consistent quality and performance in thermal management uses.

Product Description

Wurth Elektronik 40015030 WE-TGF Series Thermal Gap Pad features a thickness of 3 mm and thermal conductivity rating of 5 W/mK, designed for use as a thermal interface material between heatsinks and electronic devices. The pad is manufactured from ceramic filled silicone rubber that delivers excellent thermal performance and mechanical properties.

This thermal gap pad measures 100 mm by 100 mm, providing efficient heat transfer and filling air gaps or surface irregularities normally problematic for traditional pastes or greases. Its hardness rating of 35 Shore C offers a good balance between compressibility and durability, making it suitable for demanding industrial and electronics cooling applications.

The product operates effectively within a broad temperature range from -50°C to 150°C, allowing reliability under diverse environmental conditions. It complies with stringent environmental and safety standards including REACh and RoHS, as well as being halogen-free per IEC 61249-2-21 and JEDEC JS709B certifications.

Wurth Elektronik thermal gap pads find extensive use in electronics manufacturing, industrial automation, HVAC systems, laboratory instruments cooling, and other sectors requiring effective thermal management solutions. Their application enhances device longevity and performance by maintaining optimal operating temperatures.

The pad is made of ceramic filled silicone rubber for effective thermal conductivity. Dimensions of the pad are 100 mm by 100 mm, providing ample coverage. It has a hardness of 35 Shore C ensuring a balance of flexibility and durability.

Operates reliably within a temperature range of -50°C to 150°C. Complies with RoHS, REACh, and halogen-free standards for safety and environmental compatibility. Ideal for filling air gaps and uneven surfaces in electronic device heat dissipation applications.

Series WE-TGF ensures consistent quality and performance in thermal management uses.

EnvMart offers this Wurth Elektronik WE-TGF Series Thermal Gap Pad as part of its wide range of electronics thermal management components, perfect for professional electronics design, production, and maintenance activities.

Explore more products in our Thermal Pads category.

Wurth Elektronik WE-TGF Series Thermal Gap Pad, 3 mm Thick, 5 W/mK Thermal Conductivity, 100 mm x 100 mm Ceramic 40015030
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Frequently Asked Questions

The thermal conductivity of this thermal gap pad is 5 W/mK, which enables effective heat transfer between components.

This model measures 100 mm in length and 100 mm in width, with a thickness of 3 mm, providing ample coverage for heat dissipation applications.

It is made from ceramic filled silicone rubber, which offers excellent thermal performance and mechanical properties.

The hardness of this thermal gap pad is rated at 35 Shore C, providing a balance of flexibility and durability.

It operates reliably within a temperature range of -50°C to 150°C, making it suitable for various environmental conditions.

Yes, it complies with RoHS, REACh, and halogen-free standards, ensuring safety and environmental compatibility.

This thermal gap pad is ideal for applications in electronics manufacturing, industrial automation, HVAC systems, and laboratory instruments cooling.

It is designed to effectively fill air gaps and surface irregularities, which can be problematic for traditional thermal pastes or greases.

The thermal gap pad is manufactured in India.

The trade name for this product is WE-TGF.

A thermal conductivity rating of 5 W/mK indicates that this pad can efficiently transfer heat, enhancing the thermal management of electronic devices.

The 3 mm thickness provides adequate compressibility and ensures effective contact between surfaces, improving thermal transfer efficiency.

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