Wurth Elektronik WE-TGF Series Thermal Gap Pad, Silicone with Ceramic Particles, 2 mm Thickness, 4 W/mK Thermal 40014020

Wurth Elektronik 40014020 WE-TGF Series Thermal Gap Pad is designed to enhance thermal interface between electronic components and heatsinks, mitigating issues caused by air gaps, uneven surfaces, or rough textures. This thermal pad is composed of silicone filled with ceramic particles to provide efficient heat conduction, rated at 4 W/mK.

The pad measures 100 mm by 100 mm with a thickness of 2 mm and is colored purple. It supports continuous operation across a temperature range of -50°C to 180°C, suitable for demanding industrial and electronics cooling applications.

Compliant with Halogen Free standards (JEDEC JS709B), REACH (EC 1907/2006), and RoHS (2011/65/EU & 2015/863), this product meets stringent environmental and safety regulations.

Thermal pads like the WE-TGF series are essential in various industrial, laboratory, HVAC, and electronic manufacturing environments, providing reliable thermal management to protect sensitive components and improve overall device longevity.

Constructed of silicone with ceramic particles for superior thermal conductivity. Features a thickness of 2 mm for optimal gap filling. Thermal conductivity rating of 4 W/mK ensures efficient heat dissipation. Dimensions are 100 mm length by 100 mm width with a purple color.

Operating temperature range from -50°C up to 180°C for versatile applications. Halogen free and RoHS compliant material meeting JEDEC JS709B and EC regulations. Ideal for electrical and electronic thermal management solutions.

This thermal gap pad is suitable for industrial electronics, thermal management in manufacturing equipment, HVAC systems, laboratory devices, and water treatment electronics requiring efficient heat transfer solutions.

Explore the wide range of Thermal Pads and related electronics components at EnvMart for enhanced thermal management solutions across industries.