Wurth Elektronik WE-TGF Series Thermal Gap Pad, Silicone with Ceramic Particles, 2 mm Thickness, 2 W/mK Thermal 40012020

Wurth Elektronik 40012020 WE-TGF Series Thermal Gap Pad is engineered to facilitate effective thermal conduction between electronic components and heatsinks. It is constructed from silicone embedded with ceramic particles to deliver a thermal conductivity of 2 W/mK, ensuring efficient heat transfer.

Measuring 2 mm in thickness and 100 mm by 100 mm in surface dimension, this light blue thermal pad is designed to close air gaps and irregularities on heat dissipation surfaces where traditional thermal grease is unsuitable.

The pad exhibits a hardness of 20 Shore C, balancing flexibility and structural integrity, enabling it to conform to uneven surfaces without compromising thermal performance. It is rated for operating temperatures between -50°C and 180°C, making it suitable for a wide range of industrial and electronic applications.

The product complies with RoHS and REACH environmental standards and is halogen free according to JEDEC JS709B specifications, reflecting its suitability for modern electronic manufacturing requirements.

Wurth Elektronik Thermal Pads are widely used in electronics cooling solutions including HVAC systems, laboratory instruments, and manufacturing equipment to ensure optimal heat dissipation and improve device reliability and longevity.

Designed to fill air gaps and uneven surfaces between heatsinks and electronics. Operates reliably from -50°C to 180°C temperature range. Light blue, silicone base with ceramic particles for enhanced thermal conductivity.

Hardness of 20 Shore C ensuring durability and compliance. RoHS and REACH compliant, halogen free as per JEDEC JS709B standard. Dimensions of 100 mm x 100 mm x 2 mm thickness. Trade name Würth Elektronik eiSos GmbH & Co. KG recognized for quality.

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