Preci-Dip 1.27 mm Pitch 68 Way DIP Through Hole PLCC IC Socket 540-88-068-24-008

Preci-Dip 540-88-068-24-008 is a high-quality DIP Through Hole PLCC IC Socket with a 1.27 mm pitch and 68 contacts. Designed for reliable electrical connections, this socket is ideal for mounting integrated circuits on printed circuit boards using through hole soldering techniques.

The socket's contacts are made from phosphor bronze and plated with tin, which offers excellent electrical conductivity and corrosion resistance. It supports a current rating of 1 amp and can operate safely at voltages up to 150 volts.

The mechanical design ensures a minimum of 50 connection cycles, making it suitable for repeated insertions without compromising performance. The housing is constructed from fiberglass reinforced polyphenylene sulphide, providing robust mechanical strength and thermal stability in harsh industrial conditions.

Operating temperature ranges from -55°C up to 125°C, enabling use in a variety of environments, including industrial, manufacturing, and electronic assembly applications. The socket complies with no formal standards or approvals but meets the industry expectations for quality and durability.

This IC socket has a 1.27 mm pitch suitable for DIP mounting. It features 68 contacts arranged in 4 rows for reliable connectivity. Contacts are made of phosphor bronze with tin plating to ensure corrosion resistance. The socket supports through hole mounting and is designed for solder termination.

Operating voltage is rated up to 150 volts for use in various electronic devices. Mechanical life guarantees a minimum of 50 insertion cycles. Operating temperature range is from -55°C to 125°C, suitable for demanding industrial environments.

The housing material is fiberglass reinforced polyphenylene sulphide for high durability. Manufactured in Switzerland ensuring high quality and Swiss engineering standards.

This Preci-Dip IC socket is commonly used in electronic manufacturing, laboratory equipment, industrial control systems, and electronic prototype development where secure and reliable IC connections are essential. Its through hole design makes it compatible with standard PCB assembly processes.

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