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CHIPQUIK Lead Free Solder Paste 35 g Syringe SMD291SNL10T5
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD291SNL10T5 |
| Package Type | Syringe |
| Package Size | 35 g |
| Standards/Approvals | J-STD-005A, J-STD-004B, RoHS, J-STD-006C |
Key Features
- Solder paste is lead free and supplied in a convenient 35 g syringe package.
- Complies with industry standards J-STD-005A, J-STD-004B, RoHS, and J-STD-006C.
- Compatible with printed circuit board assembly and surface mount technology processes.
- Provides low voiding and excellent wetting on most board finishes for high-quality joints.
- Optimized for printing speeds up to 100 mm per second with long stencil life and wide process window.
- Clear residue after soldering reduces cleaning requirements and increases production efficiency.
- Passes BONO test at 1.56%, ensuring quality and performance consistency.
- Dispense grade formulation compatible with enclosed print heads in automatic assembly lines.
Product Description
CHIPQUIK SMD291SNL10T5 Lead Free Solder Paste is designed for precision electronic soldering applications requiring reliable and high-quality solder joints. The product is supplied in a 35 g syringe for ease of application and controlled dispensing in both manual and automated processes.
This solder paste is a lead-free, no-clean formulation meeting rigorous industry standards including J-STD-005A, J-STD-004B, RoHS, and J-STD-006C. Such certifications ensure compliance with environmental and safety regulations in electronics manufacturing.
With optimized printing speeds of up to 100 mm per second and a long stencil life, this solder paste offers a wide process window accommodating various printing conditions. It exhibits low voiding and excellent wetting compatibility on most board finishes, contributing to exceptional solder joint quality.
Dispense grade characteristics make it compatible with enclosed print heads, facilitating integration into automated PCB assembly lines. The clear residue left after soldering minimizes the need for cleaning, enhancing production efficiency and reducing maintenance.
The paste has successfully passed the BONO test at 1.56%, indicating its robust quality and performance standard. Originating from Canada, this solder paste is suited for industrial, laboratory, and electronics manufacturing environments demanding lead-free and RoHS-compliant materials.
Solder paste is lead free and supplied in a convenient 35 g syringe package. Complies with industry standards J-STD-005A, J-STD-004B, RoHS, and J-STD-006C. Compatible with printed circuit board assembly and surface mount technology processes.
Provides low voiding and excellent wetting on most board finishes for high-quality joints. Optimized for printing speeds up to 100 mm per second with long stencil life and wide process window. Clear residue after soldering reduces cleaning requirements and increases production efficiency.
Passes BONO test at 1.56%, ensuring quality and performance consistency. Dispense grade formulation compatible with enclosed print heads in automatic assembly lines. Explore the broad selection of Solder Pastes and related products at EnvMart for advanced electronic assembly and manufacturing solutions.
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Frequently Asked Questions
The solder paste is supplied in a 35 g syringe package, allowing for controlled dispensing.
It complies with several industry standards including J-STD-005A, J-STD-004B, RoHS, and J-STD-006C.
The solder paste is optimized for printing speeds of up to 100 mm per second, accommodating various printing conditions.
It is compatible with printed circuit board assembly and surface mount technology processes, making it suitable for precision electronic soldering applications.
The solder paste leaves a clear residue after soldering, which reduces cleaning requirements and enhances production efficiency.
It has passed the BONO test at 1.56%, indicating its quality and performance consistency.
The solder paste originates from Canada, ensuring compliance with local manufacturing standards.
This model features a lead-free, no-clean formulation that meets rigorous industry standards.
Yes, it has dispense grade characteristics that make it compatible with enclosed print heads in automatic assembly lines.
The long stencil life contributes to a wide process window, accommodating various printing conditions for enhanced operational efficiency.
It provides low voiding and excellent wetting on most board finishes, resulting in high-quality solder joints.
The model number of this solder paste is SMD291SNL10T5, which helps in identifying the specific product variant.
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