TE Connectivity Z-PACK 2 mm Pitch Futurebus+ Backplane Connector, Straight Male, 24 Column, 4 Row, 24 Way 5536501-1

TE Connectivity 5536501-1 Z-PACK 2 mm Pitch Futurebus+ Backplane Connector is a high-density, high-performance connector designed for reliable interconnection in complex electronic assemblies. Featuring a 2 mm pitch spacing, this connector supports Futurebus+ standards and facilitates signal and power transmission in backplane systems.

This straight male backplane connector consists of 24 columns and 4 rows, providing 24 contact ways to ensure robust and high-speed connections between daughterboards and motherboards. The housing is made of Liquid Crystal Polymer, known for its strength and thermal stability under industrial operating conditions.

The contacts are manufactured from phosphor bronze and plated with gold, optimizing electrical conductivity and enhancing corrosion resistance, making this connector suitable for demanding environments. The through-hole mount type with solder termination guarantees firm mechanical fixation and electrical reliability on PCB boards.

The modular design allows connectors to be stacked end-to-end, allowing scalable configurations in system design. This connector complies with IEC 1076-4-0X-(48B) standard and is ideal for use in industrial electronics, telecommunications equipment, data processing, and other high-speed communication applications.

Engineered to improve production efficiency, it is ready for insertion into machinery and complex assemblies. High-density Futurebus+ compatible with 2 mm pitch for precise fitting and performance. Straight male connector with 24 columns and 4 rows, totaling 24 contact ways.

Constructed with durable Liquid Crystal Polymer housing ensuring reliability. Contacts made from phosphor bronze with gold plating for enhanced conductivity and corrosion resistance. Designed for through-hole mount and solder termination for stable mechanical fixing.

Modular design enables end-to-end stacking for flexible system integration. Complies with IEC 1076-4-0X-(48B) standards for Futurebus+ interface. Suitable for backplane interconnection of daughterboards to motherboards in industrial and electronic applications.

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