Wurth Elektronik 885012207086 is a multilayer ceramic capacitor designed for advanced electronic applications requiring reliable surface mount components. It features a capacitance of 1 nF and operates at a DC voltage of 50 volts with a tolerance of ±10%. The capacitor comes in a compact 0805 package measuring 2 mm in length, 1.25 mm in width, and 0.8 mm in height, which facilitates dense PCB layouts in industrial and commercial electronic assemblies.
The dielectric type is X7R, classified under Class II suppression, offering stable capacitance across the operating temperature range of -55°C to 125°C. This temperature tolerance makes it suitable for use in automotive, industrial, and consumer electronics where temperature fluctuations are common.
The termination is constructed using copper, nickel, and tin layers (Cu/Ni/Sn), allowing for efficient soldering by reflow and wave soldering methods, which supports high-volume automated manufacturing processes.
Wurth Elektronik capacitors comply with RoHS directives, ensuring that the components are free from hazardous substances and environmentally safe. The high performance ceramic construction minimizes aging effects, maintaining capacitance stability over time, which is critical in precision industrial electronic controls and signal filtering applications.
Compact size 0805 package optimizes PCB space usage. Capacitance of 1 nF supports high frequency and timing circuits. Tolerant to wide temperature ranges from -55°C to 125°C. Lead-free solder compatible terminations improve manufacturability.
RoHS compliance ensures environmental and safety standards. Recommended for surface mount assembly with automated processes. Manufactured with high quality materials in Taiwan, Province Of China. Series WCAP-CSGP offers reliable and consistent performance.
This Multilayer Ceramic Capacitor is widely used in industrial electronics, telecommunications, power supplies, automotive systems, and consumer devices requiring stable capacitance and robust operational characteristics. Its surface mount design fits modern manufacturing needs for compact, high-density electronic assemblies.
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