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Toshiba Optocoupler 1-Channel Surface Mount 6-Pin SDIP TLP714(F)
Specifications
| Country of Origin | Thailand |
|---|---|
| Brand | Toshiba |
| Model | TLP714(F) |
| Mount Type | Surface |
| Series | TLP 714 |
| Maximum Operating Temperature | 125°C |
| Package Type | SDIP |
| Minimum Operating Temperature | -40°C |
| Maximum input current | 1.3mA |
| Number Of Channels | 1 |
| Standards/Approvals | CSA, UL 1557 |
| Maximum Forward Voltage | 1.7V |
| Number of Pins | 6 |
| Typical Rise Time | 0.5μs |
Key Features
- Single channel optocoupler with inverter logic output.
- Surface mount type with compact 6-pin SDIP package.
- Maximum forward voltage of 1.7 volts to ensure efficient operation.
- Typical rise and fall times of 0.5 microseconds for fast signal response.
- Maximum input current rated at 1.3 milliamperes for safe operation.
- Operating temperature range from -40 to 125 degrees Celsius for reliability in harsh conditions.
- Certified to CSA and UL 1557 standards for quality assurance.
- Offers isolation voltage of 5000 Vrms for high electrical isolation.
Product Description
Toshiba TLP714(F) is a reliable optocoupler featuring a single electrical channel, utilizing a surface mount design within a 6-pin SDIP package. It is engineered to provide inverter logic output with an isolated phototransistor output stage, enabling efficient signal isolation between circuits. The device supports a maximum forward voltage of 1.7 volts with a maximum input current of 1.3 milliamperes, ensuring operational safety and stability.
With fast typical rise and fall times of 0.5 microseconds, this optocoupler supports high-speed signal transmission suitable for industrial electronic circuits and control systems. Its industrial-grade operating temperature range of -40°C to 125°C delivers stable performance even under harsh environmental conditions.
The TLP714(F) meets CSA and UL 1557 safety approvals, underlining compliance with international standards. Its isolation voltage of 5000 Vrms guarantees high electrical isolation between input and output sections, critical for protecting microcontroller circuits and power supplies.
This device is widely applicable in industrial automation, power equipment, signal isolation, and electronic control systems. Being surface mounted and compact, it eases PCB assembly in densely packed electronic devices.
Single channel with inverter logic output. 6-pin SDIP surface mount package. Maximum forward voltage: 1.7 V. Typical rise and fall times: 0.5 μs each. Maximum input current: 1.3 mA. Operating temperature range: -40 to 125 °C.
Isolation voltage: 5000 Vrms. CSA and UL 1557 approved. Manufactured in Thailand.
This Toshiba optocoupler is an essential component in electronics, power supply isolation, industrial control systems, signal processing devices, and instrumentation. Explore similar products and more in the EnvMart Electronics Components and Optocoupler categories.
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Frequently Asked Questions
The maximum input current for this model is rated at 1.3 milliamperes, ensuring safe operation.
It operates within a temperature range of -40°C to 125°C, making it suitable for harsh environmental conditions.
This optocoupler is housed in a compact 6-pin SDIP surface mount package.
The isolation voltage of this model is 5000 Vrms, providing high electrical isolation between input and output.
The typical rise and fall times are both 0.5 microseconds, allowing for fast signal response.
It is certified to CSA and UL 1557 standards, ensuring quality assurance and safety compliance.
The maximum forward voltage for the TLP714(F) is 1.7 volts, which ensures efficient operation.
This optocoupler is widely applicable in industrial automation, power equipment, signal isolation, and electronic control systems.
This model features a single channel with inverter logic output.
It is manufactured in Thailand, as indicated by its country of origin.
The inverter logic output allows for efficient signal isolation between circuits, which is crucial in various electronic applications.
This optocoupler utilizes a surface mount design, facilitating easy PCB assembly in compact electronic devices.
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