Samtec TSW Series Straight Through Hole Pin Header 1 Contact 2.54 mm Pitch 1 Row Unshrouded TSW-101-14-T-S

The Samtec TSW-101-14-T-S straight through hole pin header is a precision PCB component engineered for reliable board-to-board electrical connectivity. Featuring a single contact arrangement on a 2.54 mm pitch, it is especially suited for applications that require pinpoint connection within compact circuit boards.

This connector employs a through-hole mount for enhanced mechanical strength and stability during assembly. Its unshrouded format allows for flexible integration in a wide variety of designs, making it ideal for custom PCB layouts, prototyping, or industrial control boards.

Designed for electrical performance, the TSW-101-14-T-S pin header is rated to handle up to 4.3A of current and supports a maximum voltage of 550V, which is suitable for high-reliability signal or power transmission. The contact is fabricated from phosphor bronze, ensuring optimal electrical conductivity, and finished with tin plating to guard against corrosion and facilitate reliable soldering.

The housing is made from polybutylene terephthalate, a robust thermoplastic known for its insulation and mechanical stability. With an operating temperature range from -55°C up to 105°C, this connector is fit for use across a range of environments, from laboratory electronics to industrial machinery and commercial equipment.

The male contact offers an 8.13 mm mating pin length, complemented by a 2.79 mm tail pin for easy solder attachment. Solder termination ensures secure integration with the PCB, promoting solid and consistent electrical connections.

Board-to-board connector systems like the TSW-101-14-T-S excel in applications such as automation, control systems, test equipment, embedded systems, and general electronics manufacturing. Its design supports vertical orientation and is also compatible with right-angle installations depending on circuit requirements.

Special features include the availability of numerous plating options and ruggedizing capabilities, enabling engineers to optimize cost and performance to match the demands of their project.

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