Wurth Elektronik 2.2 nF Multilayer Ceramic Capacitor, 50V dc, ±10% Tolerance Surface Mount 0603 WCAP-CSGP 885012206085

Wurth Elektronik 885012206085 is a 2.2 nF Multilayer Ceramic Capacitor suitable for surface mount technology (SMT) with a standard 0603 package size. It employs the X7R dielectric, which provides stable capacitance over a wide temperature range of -55°C to +125°C, making it ideal for reliable performance in industrial and commercial electronic applications.

The capacitor's ±10% tolerance ensures high electrical precision, suitable for demanding circuit applications where accuracy is critical. The robust copper, tin, and nickel termination enhances solderability and long-term mechanical stability.

This component is part of the WCAP-CSGP series, recognized for minimal ageing and consistent performance. Its compact dimensions of 1.6mm length, 0.8mm width, and 0.8mm height make it suitable for densely populated printed circuit boards in automotive, industrial, telecommunications, and consumer electronics.

With RoHS compliance, this capacitor aligns with environmental standards for safer electronics manufacturing. It is specifically designed for surface mount use, benefiting automatic assembly lines and improving production efficiency.

This 0603 package capacitor uses X7R dielectric type for high performance and stability. Operates reliably within a temperature range of -55°C to +125°C. The capacitor features copper, tin, and nickel termination for durable soldering.

It provides excellent capacitance stability with minimal ageing over time. Applicable for high precision electronic circuit designs requiring surface mount components. RoHS compliant, ensuring environmentally safer manufacturing.

Series WCAP-CSGP offers high electrical precision suitable for industrial electronics.

This component is widely used in industrial, automotive, telecommunications, and consumer electronic sectors, where compact size and reliable capacitance are essential. It enables enhanced circuit stability and is suitable for modern surface mount device assembly processes.

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