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NXP LPC1857FET256,551 32 bit ARM Cortex M3 LPC18 Microcontroller 150 MHz 1024kB ROMLess 256-Pin LBGA
Specifications
| Country of Origin | Taiwan |
|---|---|
| Brand | NXP |
| Height | 1.1mm |
| Length | 17.2mm |
| Model | LPC1857FET256,551 |
| Width | 17.2mm |
| Mount Type | Surface |
| Series | LPC18 |
| Maximum Operating Temperature | 85°C |
| Package Type | LBGA |
| Minimum Operating Temperature | -40°C |
| Interfaces | Ethernet, USB Host/OTG/Device, CAN, I²S, Fast-mode Plus (Fm+) I²C, 12-bit ADC, Motor Control PWM, Quadrature Encoder Interface, and more |
| Ram size | 200kB |
| Pay online using | Or choose to pay later via bank transfer |
| RS Stock No. | 741-4043Brand: NXPManufacturers Part No.: LPC1857FET256,551 |
| Pin Count | 256 |
| Maximum Supply Voltage | 3.6V |
| Maximum Power Dissipation Pd | 1.5W |
| Minimum Supply Voltage | 2.4V |
| Device Core | ARM Cortex M3 |
| Program Memory Size | 1024kB |
| Maximum Clock Frequency | 150MHz |
| Number of Timers | 4 |
| Instruction Set Architecture | RISC |
| ADCs | 2 x 10 Bit |
| Program Memory Type | ROMLess |
| DACs | 1 x 10 Bit |
Key Features
- Designed for embedded applications requiring advanced microcontroller capabilities.
- Operates with low power consumption, suitable for energy-efficient designs.
- Includes 200kB RAM and multiple integrated peripherals for versatile usage.
- Supports program memory size of 1024kB and ROMLess architecture.
- Surface mount LBGA package with 256 pins ensures compact and reliable connections.
- Wide operating temperature range from -40°C to 85°C for industrial applications.
- Maximum supply voltage of 3.6V with minimum supply voltage of 2.4V.
- Maximum power dissipation is 1.5W ensuring safe thermal operation.
Product Description
The NXP LPC1857FET256,551 is a high-performance 32 bit ARM Cortex M3 microcontroller from the LPC18 series designed for embedded system applications requiring robust processing power and integrated peripherals.
Operating at a maximum clock frequency of 150 MHz, this microcontroller delivers efficient computation and low power consumption, making it ideal for industrial, commercial, and automotive applications.
Equipped with 1024kB of ROMLess program memory and 200kB RAM, it supports complex program execution while maintaining energy efficiency with a power dissipation around 1.5W. The device is housed in a compact 256-pin LBGA package suitable for surface mount technology, allowing for high-density PCB layouts in demanding designs.
Its wide operating temperature range from -40°C to 85°C ensures reliable operation in harsh environmental conditions. Advanced integrated peripherals include 1 DAC (10-bit), 2 ADCs (10-bit each), and 4 timers facilitating precise control over analog and timing functions.
Connectivity is enhanced with support for Ethernet, USB Host/OTG/Device, CAN bus, I²S, Fast-mode Plus I2C, motor control PWM, and quadrature encoder interfaces, suitable for complex embedded communication and control requirements.
Designed with RISC instruction set architecture for efficient processing. Mounts using surface mount LBGA technology to optimize board space. Wide voltage range from 2.4V to 3.6V accommodates various power supply designs.
Suitable for industrial, manufacturing, automation, and communication systems. Package contains one NXP LPC1857FET256,551 microcontroller in a 256-pin LBGA surface mount package. Explore the broad range of NXP Microcontrollers with advanced features on EnvMart for your embedded system projects.
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Frequently Asked Questions
The maximum clock frequency of this microcontroller is 150 MHz.
It features a program memory size of 1024kB and utilizes a ROMLess architecture.
The microcontroller operates with a minimum supply voltage of 2.4V and a maximum supply voltage of 3.6V.
This model includes 200kB of RAM, supporting efficient program execution.
It includes 1 DAC (10-bit), 2 ADCs (10-bit each), and 4 timers for various control functions.
The operating temperature range is from -40°C to 85°C, making it suitable for industrial applications.
It is housed in a compact 256-pin LBGA package suitable for surface mount technology.
The LPC1857FET256,551 supports Ethernet, USB Host/OTG/Device, CAN bus, I²S, Fast-mode Plus I2C, and more.
The maximum power dissipation is 1.5W, ensuring safe thermal operation.
The microcontroller has a height of 1.1mm and a width of 17.2mm.
It includes 4 timers, facilitating precise timing functions for applications.
This microcontroller uses a RISC instruction set architecture for efficient processing.
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