Wurth Elektronik 47 pF Multilayer Ceramic Capacitor 25V dc ±5% Tolerance Surface Mount 0805 Case CSGP Series 885012007032

Wurth Elektronik 885012007032 is a high-precision multilayer ceramic capacitor designed for surface mount applications. Featuring a capacitance of 47 pF, it operates at a maximum voltage of 25V DC with a stable C0G dielectric construction that minimizes aging and ensures excellent temperature stability.

This surface mount device is housed in an 0805 case size with a compact footprint of 2 mm length and 1.25 mm width, and a height of 0.6 mm. It uses solder termination for secure mounting on printed circuit boards.

The capacitor tolerates ±5% capacitance variance, suitable for circuits requiring precise filtering, timing, and energy storage functions. It is qualified under several international standards including RoHS, IEC, and JEDEC JS709B, confirming its environmental compliance and reliability.

Its operating temperature range from -55°C to 125°C makes it appropriate for industrial, automotive electronics, telecommunications, and consumer electronics applications where durability and stability are paramount.

Packaged in tape and reel format, the component facilitates automated pick-and-place assembly techniques, improving production efficiency. This capacitor is commonly utilized in temperature compensation, coupling, bypass, smoothing, filtering, and resonant circuits.

Capacitance of 47 pF ensures reliable performance in filtering and timing circuits. Voltage rating of 25V DC supports low-voltage applications safely. Constructed as a stacked multilayer ceramic capacitor with C0G dielectric for temperature stability.

Case size 0805 offers compact surface mount compatibility with solder termination. Capacitance tolerance is ±5%, ensuring precision in circuit design. Operating temperature range from -55°C to 125°C enables use in diverse environments.

Complies with RoHS, EC, IEC, JEDEC JS709B, and REACH standards for environmental safety. Packaged in tape and reel form to streamline automated assembly processes. Designed for applications including temperature compensation, coupling, decoupling, and smoothing.

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