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HARWIN 3.85 mm Grounding Contact Beryllium Copper Alloy, Tin Plated, Surface Mount S1411-46R
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | HARWIN |
| Material | Beryllium Copper Alloy |
| Height | 3.85mm |
| Length | 8.79mm |
| Model | S1411-46R |
| Width | 2.28mm |
| Contact Resistance | 20mΩ |
| Contact Plating | Tin |
| Fixing Method | Surface Mount |
Key Features
- Constructed from durable beryllium copper alloy ensuring excellent conductivity.
- Tin plating enhances corrosion resistance and reliable contact performance.
- Designed for surface mount fixing on PCBs.
- Compact 3.85 mm height and 8.79 mm length for space-efficient PCB integration.
- Low contact resistance of 20mΩ supports stable electrical grounding.
- Manufactured in the United Kingdom with strict quality standards.
- Suitable for electronic prototyping, ESD control, and PCB shielding applications.
- Facilitates fast assembly of RFI shield cans without soldering, reducing PCB assembly costs.
Product Description
HARWIN S1411-46R grounding contact is a high-quality beryllium copper alloy component with tin plating, engineered for surface mount applications in electronic components, power connectors, and ESD control systems.
This 3.85 mm high grounding contact provides a low contact resistance of 20mΩ, which ensures effective electrical grounding in sensitive electronic assemblies. Its compact dimensions of 8.79 mm length and 2.28 mm width make it ideal for integration within densely populated printed circuit boards (PCBs), where space saving is critical.
The tin plating on this component provides excellent corrosion resistance and reliable contact performance, extending operational life in various environmental conditions.
Designed to facilitate easy assembly of RFI shield cans without the need for soldering, these SMT shield clips enable cost reductions in PCB manufacturing and allow the shield can to be easily removed for maintenance or repair.
This grounding contact is suitable for industrial, laboratory, manufacturing, and electronic prototyping use cases where robust grounding and EMI shielding are required. Manufactured in the United Kingdom, the product complies with stringent quality standards to ensure consistent performance.
Durable beryllium copper alloy construction for superior electrical conductivity. Tin plating for enhanced corrosion resistance and reliable contact. Surface mount fixing method for efficient PCB assembly. Compact size: 3.85 mm height, 8.79 mm length, 2.28 mm width.
Low contact resistance of 20mΩ supports reliable grounding. Facilitates solderless assembly of RFI shield cans for cost savings. Manufactured in the United Kingdom ensuring high standards. Ideal for ESD control, PCB prototyping, and electronics manufacturing.
This grounding contact is featured within the Electronics & Electricals category at EnvMart, suitable for customers seeking reliable grounding components for power connectors and electronics applications.
Explore more products in our Grounding Contacts category.
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Frequently Asked Questions
This grounding contact has a height of 3.85 mm, a length of 8.79 mm, and a width of 2.28 mm, making it compact for PCB integration.
The contact resistance of the HARWIN S1411-46R is 20mΩ, ensuring effective electrical grounding in electronic assemblies.
It is constructed from beryllium copper alloy, which provides excellent conductivity.
This grounding contact utilizes a surface mount fixing method for efficient assembly on printed circuit boards.
The contact is tin plated, which enhances its corrosion resistance and ensures reliable contact performance.
It is manufactured in the United Kingdom, adhering to strict quality standards.
This grounding contact is suitable for electronic prototyping, ESD control, and PCB shielding applications.
It facilitates fast assembly of RFI shield cans without soldering, which can reduce PCB assembly costs.
The low contact resistance of 20mΩ supports stable electrical grounding, which is critical in sensitive electronic assemblies.
Beryllium copper alloy construction ensures superior electrical conductivity, enhancing the performance of the grounding contact.
Yes, it is suitable for industrial, laboratory, manufacturing, and electronic prototyping use cases requiring robust grounding and EMI shielding.
The tin plating provides excellent corrosion resistance and reliable contact performance, extending the operational life of the component.
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