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HARWIN 2.23 mm Beryllium Copper Alloy Grounding Contact Surface Mount S1721-46R

Category Grounding Contacts Brand HARWIN Condition New

Specifications

Country of Origin United Kingdom
Brand HARWIN
Material Beryllium Copper Alloy
Height 2.23mm
Length 5.08mm
Model S1721-46R
Width 1.07mm
Contact Resistance 40mΩ
Contact Plating Tin
Fixing Method Surface Mount

Key Features

  • Manufactured from beryllium copper alloy ensuring excellent conductivity and durability.
  • Features a tin plating for reliable contact performance.
  • Compact dimensions of 5.08 mm length and 1.07 mm width.
  • Offers low contact resistance of 40 milliohms suitable for precise grounding.
  • Designed to enable fast assembly of RFI shield cans to PCBs reducing manufacturing costs.
  • Allows easy shield can removal for maintenance without soldering to the PCB.
  • Compatible with shield thickness ranging approximately from 0.13 to 0.23 mm.
  • Ideal for applications requiring effective electrostatic discharge control and prototyping boards.

Product Description

HARWIN S1721-46R grounding contact is a precision-designed electronic component crafted from beryllium copper alloy with tin plating, offering robust conductivity and corrosion resistance. Standing at 2.23 mm in height, this surface mount contact measures 5.08 mm in length and 1.07 mm in width, providing a compact solution for PCB grounding needs.

Specifically designed for rapid assembly of RFI shield cans onto PCBs, these SMT shield clips save valuable PCB space and eliminate the need for direct soldering, which decreases assembly complexity and costs. The clips facilitate easy removal of the shield can for maintenance or repair purposes, significantly improving serviceability in electronic manufacturing.

With a contact resistance of 40 milliohms, the grounding contact ensures reliable and efficient electrical connections critical for maintaining device safety and signal integrity. Suitable for shield thicknesses in the range of 0.13 to 0.23 mm, the contact supports diverse prototyping board applications, and aids in electrostatic discharge control in sensitive electronics environments.

Manufactured in the United Kingdom, the HARWIN S1721-46R grounding contact adheres to stringent quality and manufacturing standards. Its surface mount fixing method simplifies installation in automated assembly lines commonly used in industrial electronics manufacturing settings.

Manufactured from beryllium copper alloy ensuring excellent conductivity and durability. Features tin plating for reliable contact performance. Compact design with dimensions 5.08 mm length, 1.07 mm width, and 2.23 mm height.

Low contact resistance of 40 milliohms for efficient grounding. Designed for fast SMT assembly of RFI shielding on PCBs. Allows easy shield can removal for maintenance without soldering. Suitable for shield thickness 0.13 to 0.23 mm.

Supports electrostatic discharge control and prototyping board applications. Manufactured in the United Kingdom meeting quality standards.

This grounding contact suits industrial, electronic manufacturing, prototyping, and laboratory environments requiring dependable electrostatic control and efficient PCB shielding. Browse EnvMart's extensive Electronics Components category for a broad selection of connectors and grounding solutions to optimize your projects and production.

Explore more products in our Grounding Contacts category.

HARWIN 2.23 mm Beryllium Copper Alloy Grounding Contact Surface Mount S1721-46R
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Frequently Asked Questions

The contact resistance of this grounding contact is 40 milliohms, ensuring efficient grounding performance.

The HARWIN S1721-46R grounding contact has a length of 5.08 mm, a width of 1.07 mm, and a height of 2.23 mm.

It is manufactured from beryllium copper alloy, which provides excellent conductivity and durability.

This model uses a surface mount fixing method, simplifying installation in automated assembly lines.

The tin plating ensures reliable contact performance and enhances corrosion resistance.

It is suitable for shield thicknesses ranging from 0.13 to 0.23 mm.

This grounding contact is ideal for applications requiring effective electrostatic discharge control and prototyping boards.

This grounding contact is manufactured in the United Kingdom, adhering to stringent quality standards.

It enables fast assembly of RFI shield cans to PCBs and allows easy removal for maintenance without soldering.

The height of this grounding contact is 2.23 mm.

Yes, it is suitable for industrial, electronic manufacturing, prototyping, and laboratory environments.

The low contact resistance of 40 milliohms is critical for maintaining device safety and signal integrity in electronic applications.

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