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FTDI Chip UART UART, SIE 10-Pin DFN Full Speed USB to I2C Bridge Interface IC FT200XD-R
Specifications
| Country of Origin | India |
|---|---|
| Brand | FTDI Chip |
| Height | 750μm |
| Length | 3mm |
| Model | FT200XD-R |
| Mount Type | Surface |
| Series | FT200XD |
| Maximum Operating Temperature | 85°C |
| Package Type | DFN |
| Minimum Operating Temperature | -40°C |
| Number Of Channels | 1 |
| Pin Count | 10 |
| Maximum Supply Voltage | 3.3V |
| Minimum Supply Voltage | 5V |
| Maximum Data Rate | 3.4Mbps |
| Standard Supported | UART, SIE |
| Transmit FIFO | 512bit |
| Receive FIFO | 512bit |
Key Features
- Supports UART and SIE standards for reliable serial communication.
- Features 512-bit transmit and receive FIFO buffers for efficient data handling.
- Maximum data rate up to 3.4 Mbps ensuring high-speed communication.
- Surface mount package type DFN with a compact 3mm length and 750μm height.
- Operates over a temperature range from -40°C to 85°C for robust industrial use.
- Supports supply voltages ranging from 3.3 V to 5 V.
- Single channel operation suitable for efficient interface bridging tasks.
- Ideal for industrial, electronic components, and embedded system applications.
Product Description
FTDI Chip FT200XD-R is a Full Speed USB 2.0 device offering a compact and efficient interface IC solution. This 10-pin DFN packaged UART interface IC enables a seamless bridge to an I2C bus, facilitating communication at speeds up to 3.4 Mbps with low power consumption of approximately 8 mA. It features 512-bit transmit and receive FIFO buffers, ensuring smooth data flow for various embedded and industrial electronics systems.
The device operates reliably within a wide temperature range from -40°C to 85°C and supports supply voltage ranges from 3.3 V minimum to 5 V maximum, making it suitable for diverse electronic applications requiring robust performance. Its surface mount design and 3 mm length, along with a 750 μm height, allow space-efficient integration in compact electronic assemblies.
This interface IC is part of the FT200XD series and does not carry any automotive standards or specific certifications, focusing on industrial and general electronic embedded applications. It is designed to quickly and easily add USB connectivity to designs using an I2C interface, enhancing production efficiency and system capabilities.
Supports UART and SIE communication protocols for flexible interfacing. 512-bit FIFO buffers dedicated to both transmit and receive operations aid in maintaining stable data throughput. Maximum communication speed of up to 3.4 Mbps suits a range of high-speed serial interface applications.
Compact 10-pin DFN package enables surface mounting in space-constrained designs. Wide operating temperature and voltage range support use in varied industrial environments. Single communication channel allows straightforward UART to USB bridging functionality.
Designed for integration in electronics components, power connectors, and semiconductor device assemblies. It is suitable for industrial, electronics manufacturing, embedded systems, and development environments where USB to I2C bridging is required.
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Frequently Asked Questions
The FT200XD-R supports a maximum data rate of up to 3.4 Mbps, enabling high-speed communication for various applications.
It supports UART and SIE communication protocols, allowing for flexible interfacing in electronic applications.
The FT200XD-R operates reliably within a temperature range from -40°C to 85°C, making it suitable for industrial environments.
This model supports supply voltages ranging from 3.3 V to 5 V, accommodating various electronic designs.
It comes in a 10-pin DFN package type, with a compact length of 3 mm and a height of 750 μm, suitable for space-constrained designs.
This interface IC features a single communication channel, which is suitable for efficient UART to USB bridging tasks.
The FT200XD-R includes 512-bit FIFO buffers for both transmit and receive operations, ensuring smooth data flow.
Yes, it is designed for use in embedded systems and various industrial applications, facilitating USB to I2C bridging.
The device operates with a low power consumption of approximately 8 mA, making it efficient for various applications.
The FT200XD-R is manufactured in India, contributing to its availability for various electronic applications.
The 512-bit FIFO buffers dedicated to transmit and receive operations help maintain stable data throughput, essential for reliable communication.
This model is suitable for industrial, electronic manufacturing, and development environments where USB to I2C bridging is required.
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