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FTDI Chip Communication & Wireless Development Kit VNC2 Vinculum Module V2DIP2-32

Category Development Kit Brand FTDI Chip Condition New

Specifications

Country of Origin China
Brand FTDI Chip
Model V2DIP2-32
Interfaces USB ’A’ type USB socket to interface with USB peripheral devices
Interface Type UART, SPI, USB
Standards/Approvals RoHS
Kit Classification Development Kit
Kit Name VNC2 Vinculum Module

Key Features

  • The development kit includes the VNC2 Vinculum module with USB Host controller capabilities.
  • Supports USB device classes such as BOOMS, Printer, and HID devices.
  • Handles FAT file structures transparently for mass storage devices.
  • Interfaces with microcontrollers via UART, SPI, or parallel FIFO interfaces.
  • Offers firmware development using the Vinculum II software tool suite with IDE support.
  • Includes USB A type socket and auxiliary +3.3V power output for external logic.
  • Available in multiple package formats including 32-lead LQFP and QFN.

Product Description

FTDI Chip V2DIP2-32 Communication & Wireless Development Kit is a professional development solution designed for embedded USB Host controller applications. It features the Vinculum VNC2 device, a second-generation embedded dual USB host controller that supports a range of USB device classes including bulk only mass storage (BOMS), printer, and human interface devices (HID).

This development kit enables developers to integrate USB Host functionality into products lacking dedicated USB hardware resources. It transparently manages FAT file systems for USB mass storage devices such as flash drives, simplifying data handling processes.

The VNC2 supports communication with non-USB devices through UART, SPI, or parallel FIFO interfaces, which can be programmed for various I/O pins, offering flexibility in system design. The module operates on a single +5V supply and provides an auxiliary +3.3V @ 200mA power output suitable for external logic components.

Firmware development and upgrades are supported through the Vinculum II integrated development environment (IDE), which includes compiler, linker, and debugger tools. Debugger interfaces are accessible via DIL pins or a 6-way male header to connect with a debugger module.

The V2DIP2-32 module is available in several packaging options including 32-lead LQFP and QFN types, providing options suitable for different integration requirements. Includes USB 'A' type USB socket for peripheral device interfacing.

Supports UART, SPI, and parallel FIFO programmed to multiple I/O pins. Single +5V supply input with auxiliary +3.3V power output. Vinculum II development suite supports full firmware customization. Firmware upgrades available via UART or debugger interface header.

Compact 32-lead LQFP package for embedded system integration. Provides cost-effective USB Host capability for embedded designs.

This Development Kit is well suited for use in industrial communication systems, embedded computing, USB device interface applications, and prototyping environments involving microcontrollers and USB peripherals.

Explore more Communication & Wireless Development Tools in the Electronics & Electricals category at EnvMart for comprehensive solutions.

FTDI Chip Communication & Wireless Development Kit VNC2 Vinculum Module V2DIP2-32
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