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| Country of Origin | India |
|---|---|
| Voltage | 1.5V |
| Brand | TE Connectivity |
| Orientation | Right Angle |
| Current | 500mA |
| Mount Type | Surface |
| Housing Material | Thermoplastic |
| Contact Material | Copper Alloy |
| Termination Type | Solder |
| Maximum Operating Temperature | 85°C |
| Minimum Operating Temperature | -55°C |
| Pitch | 0.6mm |
| Row Spacing | 8.2mm |
| Contact Plating | Gold over Nickel |
| Number of Contacts | 204 |
| Memory Socket Type | DIMM |
| Insertion/Removal Method | Cam-In |
| SDRAM Type | DDR3 |
TE Connectivity 2-2013289-1 is a right angle surface mount DIMM socket designed specifically for DDR3 memory modules, providing a 0.6 mm pitch with 204 contacts. Operating at 1.5V and rated for 500mA current, this socket ensures high-speed and reliable interconnection for DDR3 SO DIMM modules. Its copper alloy contacts feature gold over nickel plating, ensuring excellent electrical performance and corrosion resistance.
The socket incorporates cam-in module insertion, allowing easy installation and removal, supported by secure ejector latches to maintain module retention. The thermoplastic housing withstands a wide operating temperature range from -55°C to 85°C, making it suitable for demanding industrial and commercial environments.
Mechanical voltage keying and anti-stubbing contact designs protect the memory modules from incorrect installation and physical damage. The device has a row spacing of 8.2mm, conforming to JEDEC SO DIMM standards.
This DIMM socket is widely applicable in high-speed data applications including notebooks, servers, workstations, printers, storage devices, and communication equipment requiring reliable memory socket connections.
Designed for 204-way surface mount DDR3 DIMM memory modules. Operating voltage of 1.5V ensuring compatibility with DDR3 standards. Copper alloy contacts plated with gold over nickel for durability and conductivity. Cam-in insertion method provides easy and secure module installation.
Thermoplastic housing withstands temperatures from -55°C to 85°C. Mechanical voltage keying and anti-stubbing contact design enhances reliability. Row spacing of 8.2mm compatible with JEDEC SO DIMM modules. Latches securely retain memory modules, avoiding stubbing issues.
Recommended for notebooks, servers, workstations, and communication devices. Explore EnvMart for a wide selection of Memory Sockets and related electronic components to support your industrial, laboratory, and commercial electronics projects.
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