TE Connectivity DDR3 SO DIMM Memory Socket 0.6 mm Pitch 204 Way Right Angle Surface Mount 1.5V, 500mA 2-2013289-1

TE Connectivity 2-2013289-1 DDR3 SO DIMM Memory Socket is a high-performance memory interface designed for reliable electrical and mechanical connections to Small Outline Dual Inline Memory Modules (SO DIMM) compliant with JEDEC DDR3 standards. Operating at 1.5V with a current rating of 500mA, this surface mount socket supports dense 204-contact arrays with a fine 0.6 mm pitch.

Constructed with a thermoplastic housing and copper alloy contacts plated in gold over nickel, it ensures optimized signal integrity and durability across operational temperature ranges from -55°C up to 85°C. The socket employs a cam-in insertion/removal method enabling straightforward module installation and removal while its mechanical voltage keying and anti-stubbing contact design protect memory modules from incorrect insertion.

The right angle orientation allows for efficient PCB space utilization and compatibility with various system designs including notebook PCs, servers, printers, workstations, storage solutions, and communication devices. Secure retention is provided without extra latching, relying on precise contact design and solder pegs for firm PCB attachment.

With 204 contacts arranged at 0.6 mm pitch and an 8.2 mm row spacing, this memory socket meets demanding requirements for high-speed data applications. It is RoHS compliant and suitable for modern computing environments requiring compact, reliable memory connection solutions.

Supports high-speed DDR3 data transfer for SGRAM SO DIMM modules. Features cam-in insertion/removal method for easy module installation. Right angle orientation optimizes PCB layout and connectivity. Contact plating of gold over nickel ensures reliable conductivity and corrosion resistance.

Housing made of durable thermoplastic material for long service life. Operates reliably between -55°C to 85°C temperature range. Provides mechanical voltage keying and anti-stubbing contact design for safe module insertion.

Solder pegs enable secure mounting to the PCB surface. 204 contact points arranged with 0.6 mm pitch and 8.2 mm row spacing for precise alignment. Compatible with applications in notebooks, servers, printers, and communication devices.

Explore more high-quality Memory Sockets and electronic components at EnvMart for your industrial, computing, and communication hardware needs.