TE Connectivity 0.6 mm Pitch 200 Way Right Angle Surface Mount DDR2 DIMM Socket 1.8V 500mA 1827341-4

TE Connectivity 1827341-4 Surface Mount DDR2 DIMM Socket is engineered for reliable and high-performance memory module connections in electronic devices and computing applications. Featuring a 0.6 mm pitch and 200 contact points, this right angle oriented socket fits compact PCB designs while maintaining signal integrity.

The socket employs copper alloy contacts plated with gold to ensure excellent conductivity and corrosion resistance. Its housing is constructed from liquid crystal polymer material, providing durability and UL 94 V-0 flame retardant certification.

Operating voltage is 1.8V with a maximum current of 500mA, suitable for DDR2 memory modules. The product supports a wide temperature range from -55°C to 85°C, ensuring robust operation in industrial, computing, and telecommunications equipment.

Installation is facilitated by a cam-in insertion/removal method and surface mount technology with solder termination, allowing efficient PCB assembly. The design does not include a latching mechanism, which simplifies the module replacement process.

This DDR2 SODIMM socket is ideal for use in industrial electronics, laboratory equipment, telecommunications hardware, and commercial computing devices. Its compact right angle form factor and durable construction make it suitable for demanding applications requiring secure, high-density memory module connections.

The socket type is SO, DIMM, DDR2 suitable for memory module connections. Right angle orientation optimizes PCB layout in constrained spaces. High-quality contact material is copper alloy with gold plating to ensure reliable conductivity.

Surface mount design enables easy soldering and integration on printed circuit boards. Operating temperature range from -55°C to 85°C supports robust performance in varied environments. The socket supports a row spacing of 6.2mm, ensuring compatibility with standard modules.

Meets UL 94 V-0 flame retardance standards for housing material made of liquid crystal polymer. The insertion and removal method utilizes a cam-in mechanism for secure connections. Termination type is solder, compatible with typical manufacturing processes.

No latching mechanism is included, simplifying installation and maintenance. Explore more memory socket components by TE Connectivity on EnvMart for your electronic assembly and maintenance needs.

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