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TE Connectivity 0.6 mm Pitch 200 Way Right Angle Board Mount DIMM Socket 2.5V 500mA 1717254-1

Category Memory Sockets Brand TE Connectivity Condition New

Specifications

Country of Origin China
Voltage 2.5V
Brand TE Connectivity
Orientation Right Angle
Current 500mA
Mount Type Board
Housing Material Thermoplastic
Contact Material Copper Alloy
Series DDR
Maximum Operating Temperature -55°C
Minimum Operating Temperature -85°C
Pitch 0.6mm
Row Spacing 6.2mm
Standards/Approvals RoHS
Contact Plating Gold Flash
Number of Contacts 200
Memory Socket Type DIMM
Insertion/Removal Method Locking

Key Features

  • The socket supports 200 contacts with 0.6 mm pitch for high-density configurations.
  • Right angle orientation enables efficient board mounting and space-saving layouts.
  • Designed for 2.5V operation with a maximum current of 500mA for stable performance.
  • Contact material is copper alloy with gold flash plating to ensure durable conductivity.
  • Housing is made of thermoplastic, resistant to temperatures ranging from -85°C to -55°C.
  • The locking insertion/removal method provides secure connection and latching mechanism.
  • Row spacing measures 6.2 mm for precise module alignment.
  • Complies with RoHS standards ensuring environmental safety.

Product Description

TE Connectivity 1717254-1 is a 0.6 mm pitch, 200 way right angle board mount DIMM socket designed for high-density memory module interfacing in computing and server applications. Operating at 2.5V with a current capacity of 500mA, this socket ensures reliable electrical connection for DDR series memory modules.

The socket features copper alloy contacts plated with gold flash for excellent conductivity and corrosion resistance. Its thermoplastic housing withstands minimum operating temperatures of -85°C and maximum temperatures of -55°C, suitable for harsh industrial and electronic environments. The right angle orientation facilitates optimized printed circuit board layouts and secure mounting.

Equipped with a locking insertion/removal method and a latching mechanism, it guarantees secure memory module retention and easy servicing or replacement. The 6.2 mm row spacing and 0.6 mm pitch support high-density PCB designs prevalent in personal computers, servers, and workstations.

This memory socket complies with RoHS regulations, ensuring environmentally responsible manufacturing and usage. It is manufactured in China and is part of the DDR memory series. The socket supports 200 contacts with 0.6 mm pitch for high-density configurations.

Right angle orientation enables efficient board mounting and space-saving layouts. Designed for 2.5V operation with a maximum current of 500mA for stable performance. Contact material is copper alloy with gold flash plating to ensure durable conductivity.

Housing is made of thermoplastic, resistant to temperatures ranging from -85°C to -55°C. The locking insertion/removal method provides secure connection and latching mechanism. Row spacing measures 6.2 mm for precise module alignment.

Complies with RoHS standards ensuring environmental safety. Ideal for applications in personal computers, servers, and workstation memory modules. Manufactured in China following DDR series specifications for compatibility.

This socket is essential for industrial and electronic applications including computing, server memory upgrades, manufacturing equipment, and laboratory instrumentation requiring modular memory solutions. Explore more products within the Electronics & Electricals category at EnvMart for comprehensive solutions.

Explore more products in our Memory Sockets category.

TE Connectivity 0.6 mm Pitch 200 Way Right Angle Board Mount DIMM Socket 2.5V 500mA 1717254-1
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