TE Connectivity DDR3 DIMM Socket 1 mm Pitch 240 Way Through Hole Mount, 1.5V, 500mA 1932000-1

TE Connectivity 1932000-1 DDR3 DIMM Socket 1 mm Pitch 240 Way through hole mount is a premium memory socket designed specifically for DDR3 SDRAM modules. Operating at 1.5 volts and supporting up to 500mA current, this socket offers robust electrical performance for a variety of electronic components including mobile, desktop, server, and communication equipment.

The socket incorporates 240 gold-plated copper alloy contacts arranged with a 1 mm pitch providing reliable and consistent electrical connections. The housing is constructed from high-temperature resistant nylon material, offering durability and stability across an operating temperature range of -55°C to 85°C.

With a dual row design and 1.9 mm spacing between rows, it allows compact PCB mounting with secure mechanical retention through standard plastic latches. The direct insert and removal method simplifies module handling and maintenance.

Termination is by soldering, ensuring robust and long-lasting mounting on printed circuit boards. This socket is engineered for next-generation DDR3 memory technologies, replacing older 184 position DDR sockets, and is widely applicable in industrial, laboratory, commercial, and telecommunications sectors.

Designed with anti-stubbing contact technology, this socket retains the reliable performance expected in modern high-speed memory applications. Packaging includes one through hole mount DDR3 DIMM socket ready for integration into electronic manufacturing processes.

The socket features 240 contacts arranged with a 1 mm pitch for reliable signal transmission. It supports a voltage rating of 1.5V and a current rating of 500mA. The housing is made from durable nylon with gold plated copper alloy contacts ensuring excellent conductivity and corrosion resistance.

Designed for direct insert and removal, the socket includes latching mechanisms for secure module retention. The operating temperature range is from -55°C to 85°C, suitable for demanding electronic environments. It uses a dual row configuration with 1.9 mm row spacing for compact PCB layouts.

The termination type is solder, compatible with standard through hole PCB assembly processes. The connector is ideal for mobile, desktop, server, and communication equipment applications requiring DDR3 memory integration.

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