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HARWIN 2 mm Ultra Low Profile Titanium Copper Alloy Spring Contact Surface Mount Gold Plated S7271-45R

Category Grounding Contacts Brand HARWIN Condition New

Specifications

Country of Origin Korea
Brand HARWIN
Material Titanium Copper Alloy
Current 1A
Height 2mm
Length 3.5mm
Model S7271-45R
Width 1.5mm
Contact Resistance 50mΩ
Contact Plating Gold
Fixing Method Surface Mount

Key Features

  • Made from titanium copper alloy for durability and conductivity.
  • Gold plated contact ensures reliable low resistance connection.
  • Surface mount fixing method suitable for automated assembly lines.
  • Compact dimensions with 2 mm height and 3.5 mm length.
  • Designed to prevent overcompression and maintain spring force.
  • Ideal for antenna feeds in mobile devices such as smartphones.
  • Suitable for wiping and sliding contact applications.
  • Low contact resistance of 50mΩ supports signal integrity.

Product Description

HARWIN S7271-45R is a 2 mm ultra low profile spring contact crafted from titanium copper alloy with gold plating, engineered for surface mount technology assembly. This spring contact incorporates advanced features such as a protected tip to prevent mechanical hooking and a positive stop shoulder that guards against overcompression, preserving the spring's force and reliability.

Its compact dimensions of 2 mm height, 3.5 mm length, and 1.5 mm width make it ideally suited for integration within highly space-constrained electronic devices. The low contact resistance of 50 milliohms ensures minimal signal loss, while a current rating of 1 ampere meets the requirements of low power electronic circuits.

Designed for automated production, this EZ-BoardWare antenna spring contact is perfect for enabling high-frequency antenna feeds in mobile devices such as smartphones, providing reliable wiping and sliding contact capabilities. The gold plating guarantees superior corrosion resistance and signal consistency over long usage.

Beyond mobile applications, this spring contact is also suitable for LED lamp connections and RFID tag interfaces where reliable, low-profile grounding contacts are required. Made from titanium copper alloy for durability and conductivity.

Gold plated contact ensures reliable low resistance connection. Surface mount fixing method suitable for automated assembly lines. Compact dimensions with 2 mm height and 3.5 mm length. Designed to prevent overcompression and maintain spring force.

Ideal for antenna feeds in mobile devices such as smartphones. Suitable for wiping and sliding contact applications. Low contact resistance of 50mΩ supports signal integrity. Rated for a current of 1 ampere for low power electronic use.

This spring contact is manufactured in Korea, Republic Of, preserving high quality standards. It is an excellent choice for use in industrial, electronic manufacturing, telecommunications, and consumer electronics sectors.

Explore related Grounding Contacts and electronic components at EnvMart for your precise prototyping and production needs.

HARWIN 2 mm Ultra Low Profile Titanium Copper Alloy Spring Contact Surface Mount Gold Plated S7271-45R
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