TE Connectivity 0.6 mm Pitch 200 Way Right Angle Surface Mount DDR2 DIMM Socket 1.8V 500mA 1565917-4

TE Connectivity 1565917-4 is a high-quality DDR2 DIMM socket designed for surface mount applications, featuring a 0.6 mm pitch and 200 contact positions arranged in a right angle configuration. It operates at 1.8 volts with a current rating of 500 mA, suitable for modern DDR2 SDRAM memory modules in computing systems.

The socket is constructed with copper alloy contacts plated with a gold flash finish, ensuring excellent conductivity and corrosion resistance. The black thermoplastic housing is UL 94V-0 rated for flame retardance and provides robust mechanical support. Its cam-in insertion/removal method offers reliable module engagement and retention with an integrated latching locking mechanism.

This connector operates efficiently within an extended temperature range from -55°C to 85°C, making it suitable for various industrial, commercial, and electronic manufacturing applications. The 6.2 mm row spacing and 5.2 mm stack height provide standard profiles for DDR2 SO DIMM modules. Packaging on tape and reel with 150 pieces facilitates seamless pick-and-place assembly.

TE Connectivity 1565917-4 DIMM socket is ideal for applications including computer motherboards, networking devices, and other electronic equipment requiring robust memory interface solutions. It ensures compliance with standard DDR2 DDRAM interfaces, supporting reliable data transmission and system integrity.

The socket features a 0.6 mm pitch and 200 contact positions organized in two rows. It is designed with a right angle orientation for surface mounting on PCBs. Contacts are made of copper alloy with gold flash plating to ensure reliable signal integrity.

The housing material is thermoplastic with a black color and UL 94V-0 flame rating. The product supports DDR2 SDRAM modules with a row spacing of 6.2 mm and latching locking mechanism. Operating temperature range is from -55°C to 85°C, suitable for industrial and commercial environments.

Insertion and removal use a cam-in method for secure module retention. Packaging is done on tape and reel with 150 units per reel, ideal for automated assembly processes. Compliance with DDR2 SO DIMM series standards for compatibility in computing applications.

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