Amphenol Communications Solutions BergStak Series Straight Surface PCB Header 120 Contacts 0.8 mm Pitch 2 Row 61083-123402LF

The Amphenol Communications Solutions 61083-123402LF BergStak Series Straight Surface PCB Header is a high-performance connector designed for demanding board-to-board connections. This header features a double-row configuration with 120 contacts, allowing for efficient high-density signal routing in modern electronic designs.

With a 0.8 mm pitch between contacts and shrouded structure, it helps conserve PCB space and ensures secure mating. The housing is constructed from Liquid Crystal Polymer, offering excellent mechanical strength and heat resistance, while the contacts are made from brass with gold plating for optimal conductivity and corrosion resistance.

This header provides a straight surface-mount orientation, simplifying soldering processes and enabling easy integration during automated or manual assembly. It reliably supports up to 100V and 800mA per contact, making it ideal for electronic, industrial, and communication equipment requiring robust and compact connectivity solutions.

Highlights include scoop-proof feature housing to prevent reverse mating, compatibility with PCIe Gen 2/3 and SAS 3.0 high-speed performance (for selected stack heights), and vertical versus vertical mating flexibility. The product operates within wide temperature ranges from -40°C to 125°C, suitable for harsh environments and high-speed signal transmission applications.

Typical applications include parallel board stacking in industrial electronics, embedded systems, control boards, and communication devices. Multiple plating and packaging options are available, and PCB locator pegs can be selected when required.

Accommodates 120 contacts for high-density board-to-board connectivity. Features 0.8 mm double-row contact pitch to conserve PCB space. Built with robust Liquid Crystal Polymer housing and brass, gold-plated contacts for durability.

Supports operating voltage up to 100V and current up to 800mA. Straight surface-mount design ensures easy soldering and integration in assemblies. Suitable for parallel board stacking and high-speed signal transmission applications.

Scoop-proof housing prevents reverse mating and facilitates manual assembly. Operates reliably from -40°C to 125°C for a wide range of environments. Shrouded construction provides enhanced alignment and mating security. Compatible with PCIe Gen 2/3 and SAS 3.0 high-speed applications (on selected stack heights).

For industrial, commercial, and advanced electronics assembly, browse Amphenol Communications Solutions and PCB Header products on EnvMart.