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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to PGA WA13087DQAETRC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | WA13087DQAETRC |
| Mount Type | Through Hole |
| Housing Material | Fibreglass |
| Contact Material | Brass |
| Pitch | 2.54mm |
| Connection Gender A | Female |
| Number of Contacts A | 48 |
| Connection Gender B | Male |
| Connection A | QFN |
| Connection B | PGA |
Key Features
- The adapter supports a 48-contact Quad-Flat No-Leads (QFN) connection on one side.
- It converts to a 48-contact Pin Grid Array (PGA) connection on the opposite side.
- The mount type is through hole with a straight orientation for reliable PCB integration.
- Contacts are made of brass material, ensuring durability and good conductivity.
- The housing is constructed from fibreglass for structural stability and electrical insulation.
- Designed to reduce development costs by converting package style without board redesign.
- The adapter does not include a central ground pad.
- Manufactured in the United Kingdom adhering to high quality standards.
Product Description
Winslow WA13087DQAETRC IC Socket Adapter is a high-quality component designed to convert Quad-Flat No-Leads (QFN) packages with 48 contacts into Pin Grid Array (PGA) format through a reliable through hole mount with a 2.54 mm pitch. This adapter is ideal for electronic development and prototyping environments where reusing existing board designs is essential to reducing time and costs.
The adapter features a brass contact material ensuring excellent electrical conductivity and robustness during repeated insertions. Its fibreglass housing provides mechanical strength along with excellent insulation properties suitable for electronic circuit assemblies.
With straight orientation and through hole mounting type, the adapter guarantees easy integration onto printed circuit boards (PCBs) in industrial, laboratory, and manufacturing applications that require reliable interconnection of integrated circuits.
This 'Adaptics' series component enables seamless conversion between surface mount QFN packages and traditional PGA pin layouts, removing the need to redesign base boards for alternative IC packaging.
The device supports 48 electrical contacts on both QFN and PGA sides with connection genders female (QFN side) and male (PGA side) respectively, facilitating dependable connections.
The adapter converts package styles, reducing PCB redesign costs. Through hole mount ensures firm attachment and electrical stability. Brass contacts offer reliable conductivity and durability. Fibreglass housing imparts mechanical strength and insulation.
48 contacts support high-density IC connections. Straight orientation suits conventional PCB layouts. Manufactured in the United Kingdom ensuring premium quality.
This product is extensively used in electronics manufacturing, testing labs, and prototyping sectors where IC packaging conversion is required to maintain design flexibility and reduce production lead times.
Explore the wide range of Winslow IC Socket Adapters on EnvMart for dependable and high-performance electronic component solutions compatible with multiple packaging standards.
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Frequently Asked Questions
The pitch of this adapter is 2.54 mm.
It supports 48 electrical contacts on both the QFN and PGA sides.
This model uses a through hole mounting type for reliable PCB integration.
The contacts are made of brass for good conductivity, while the housing is constructed from fibreglass for structural stability and insulation.
It is manufactured in the United Kingdom, adhering to high quality standards.
The orientation of this adapter is straight, suitable for conventional PCB layouts.
It converts Quad-Flat No-Leads (QFN) connections to Pin Grid Array (PGA) connections.
No, the adapter does not include a central ground pad.
This adapter is suitable for electronic development, prototyping, and applications in manufacturing and testing labs.
It helps maintain design flexibility by allowing the reuse of existing board designs, thus reducing development time.
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