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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter SOP to DIP W9583RC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | W9583RC |
| Mount Type | Through Hole |
| Housing Material | FR4 |
| Contact Material | Brass |
| Pitch | 2.54mm |
| Contact Plating | Tin over Nickel |
| Connection Gender A | Female |
| Number of Contacts A | 10 |
| Connection Gender B | Male |
| Connection A | SOP |
| Connection B | DIP |
Key Features
- This adapter supports SOP, SSOP, TSOP, TSSOP, MSOP, and QSOP packages.
- Features a 2.54 mm pitch for through-hole mounting.
- Includes 10 contacts on both SOP and DIP sides for reliable connectivity.
- Constructed with brass contacts plated in tin over nickel for corrosion resistance.
- Housing material is high-quality FR4 ensuring durability and electrical insulation.
- The orientation is straight and mount type is through hole for standard PCB integration.
- Designed for converting SOP style ICs to standard DIP format to ease prototype and development.
- Manufactured in the United Kingdom to high quality standards.
Product Description
Winslow W9583RC Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter provides an essential solution for converting small outline IC packages such as SOP, SSOP, TSOP, TSSOP, MSOP, and QSOP to a dual in line package (DIP) format. This adapter facilitates easy integration of surface mount ICs into DIP sockets for prototyping, testing, and development.
The product features 10 contacts on both the SOP and DIP connections with a standard 2.54 mm pitch designed for through-hole PCB mounting. The contact material is brass plated with tin over nickel, ensuring reliable contact performance and long-term durability. The housing material is FR4, a widely used flame-retardant fiberglass epoxy laminate that provides robust electrical insulation and mechanical strength.
This adapter’s straight orientation and through hole mount type make it perfectly suited for standard PCB assembly processes, allowing engineers and developers to evaluate SOP style ICs in DIP configurations without requiring costly board redesigns.
Originating from the United Kingdom, this Winslow adapter meets industrial requirements and is supplied new for immediate use in laboratory, industrial, and manufacturing environments.
This adapter converts multiple small outline IC package styles to DIP format for flexibility. 2.54 mm pitch ensures compatibility with standard DIP sockets and through-hole PCB layouts. Brass contacts with tin over nickel plating provide excellent conductivity and corrosion resistance.
FR4 housing material delivers mechanical stability and insulation for safe operation. Straight orientation and through hole mounting support easy PCB integration. Ideal for prototyping, testing, and development of electronic circuits using SOP devices.
Manufactured in the United Kingdom to precise quality standards.
This IC socket adapter is a valuable component in electronics development and manufacturing, enabling cost-effective adaptation of small outline ICs and reducing redesign efforts. Browse EnvMart’s extensive connector and adapter category for compatible interconnection solutions from top brands like Winslow.
Explore more products in our IC Socket Adapters category.
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Frequently Asked Questions
The pitch size of this IC socket adapter is 2.54 mm, which is standard for through-hole mounting.
It supports various IC packages including SOP, SSOP, TSOP, TSSOP, MSOP, and QSOP.
The contacts are made of brass plated with tin over nickel, and the housing is constructed from FR4 material.
This adapter features 10 contacts on both the SOP and DIP sides for reliable connectivity.
The orientation of this adapter is straight, designed for straightforward PCB integration.
The mount type is through hole, suitable for standard PCB assembly processes.
This adapter is manufactured in the United Kingdom to high quality standards.
The connection gender for the SOP side is female, while the DIP side is male.
It is primarily used for converting small outline ICs to DIP format, facilitating prototyping and development.
Brass contacts with tin over nickel plating provide excellent conductivity and corrosion resistance, ensuring reliable performance.
The FR4 housing material provides robust electrical insulation and mechanical strength, making it suitable for electronic applications.
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