Preci-Dip 803 Series Straight Surface PCB Socket 10-Contact 2 Row 2.54 mm Pitch Solder 803-87-010-10-001101

Preci-Dip 803-87-010-10-001101 PCB Socket is a high-quality 10-contact, 2-row surface mount connector featuring a 2.54 mm pitch and straight orientation. Manufactured using black glass filled polyester for the housing, it offers excellent mechanical strength and electrical performance in board-to-board electronic connections.

The socket is designed to handle up to 12A current and 150V voltage ratings, suitable for demanding electronic assemblies. The contacts are made from beryllium copper alloy with a gold flash plating, ensuring high conductivity and reliable signal integrity. This component supports solder termination with a surface mounting style that is optimal for automated PCB assembly processes.

Operating within a temperature range of -55°C to 125°C, this connector is engineered to perform reliably in harsh industrial and laboratory environments. The female contact gender and precise 2.54 mm pitch spacing ensure compatibility with a broad range of components and designs.

The 803 series sockets meet UL 94V-0 standards for flammability, providing enhanced safety and regulatory compliance. Made in Switzerland, the product reflects superior Swiss engineering standards, making it suitable for diverse PCB applications in electronics, power connectors, and industrial control systems.

The socket utilizes black glass filled polyester housing for durability. It supports a 12A current rating with 150V voltage rating. Contacts feature beryllium copper alloy with gold flash plating. Operation range is from -55°C to 125°C.

Solder termination with surface mount and straight orientation. Connector system is board-to-board, female contact type. Pitch is standardized at 2.54 mm over 2 rows. Meets UL 94V-0 flammability standard for safety. Manufactured in Switzerland ensuring quality.

Applicable for industrial, laboratory, and manufacturing PCB solutions.

This Preci-Dip PCB socket assembly enhances connectivity and reliability in electronic device manufacturing, embedded systems, and power distribution setups. It is ideal for engineers and designers aiming for robust, high-performance board-to-board connections.

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