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Infineon NOR 256 MB SPI Flash Memory 16-Pin SOIC S25FL256LAGMFI000

Category Flash Memory Brand Infineon Condition New

Specifications

Country of Origin India
Brand Infineon
Height 2.55mm
Length 10.3mm
Cell Type NOR
Model S25FL256LAGMFI000
Width 7.5mm
Mount Type Surface
Series S25FL256
Maximum Operating Temperature 85°C
Package Type SOIC
Minimum Operating Temperature -40°C
Memory size 256MB
Interface Type SPI
Standards/Approvals RoHS
Pin Count 16
Automotive Standard AEC-Q100
Maximum Supply Voltage 3.6V
Minimum Supply Voltage 2.7V
Organisation 32M x 8 Bit
Number of Bits per Word 8
Number of Words 32M

Key Features

  • Memory size of 256 MB with a 32M x 8 bit organisation.
  • Features a 16-pin SOIC package for surface mounting.
  • Supports SPI interface with Single, Dual, and Quad I/O modes.
  • Operating voltage range from 2.7 V to 3.6 V.
  • Reliable operation between -40°C and 85°C operating temperatures.
  • Compliance with RoHS standards ensures environmental safety.
  • Automotive grade standard AEC-Q100 certified for durability.
  • Ideal for code shadowing, direct code execution (XIP), and reprogrammable data storage.

Product Description

Infineon S25FL256LAGMFI000 NOR 256 MB SPI Flash Memory 16-Pin SOIC module offers high-density flash memory with advanced SPI interface features. The device supports standard SPI single bit serial input/output, Dual I/O, Quad I/O, and Quad Peripheral Interface commands, including Double Data Rate read commands suitable for high-speed applications.

This NOR flash memory includes a 256-byte page programming buffer allowing rapid programming operations. It supports individual 4KB sector erase, 32KB half-block erase, 64KB block erase, and full chip erase functions, providing flexibility tailored to various application requirements.

The device complies with automotive standard AEC-Q100, enhancing its reliability in demanding automotive and industrial environments. Operating voltage ranges from 2.7 V to 3.6 V, and it functions reliably in temperatures spanning -40°C to 85°C, making it suitable for a broad range of applications.

Its compact 16-pin SOIC surface-mount package with dimensions of 10.3 mm length, 7.5 mm width, and 2.55 mm height facilitates integration into tight spaces within embedded and mobile system designs.

These properties make it ideal for applications requiring efficient code shadowing to RAM, direct code execution from flash memory (XIP), and flexible, reprogrammable data storage. It meets RoHS standards for environmental compliance.

Memory size of 256 MB with 32M words by 8 bits organisation. SPI interface supports single, dual, and quad I/O protocols. 16-pin SOIC package designed for surface mounting with compact dimensions. Wide operating voltage and temperature ranges ensure versatility.

Automotive-grade certification AEC-Q100 supports high-reliability use. Advanced erase and program features ensure flexible memory management. Low pin count reduces complexity for embedded system manufacturing. Suitable for mobile, embedded, automotive, and industrial applications.

Explore our extensive range of semiconductor and Flash Memory products at EnvMart for diverse electronics and embedded system needs.

Infineon NOR 256 MB SPI Flash Memory 16-Pin SOIC S25FL256LAGMFI000
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Frequently Asked Questions

The memory size of this model is 256 MB, organized as 32M x 8 bits.

It operates within a voltage range of 2.7 V to 3.6 V.

The dimensions of the package are 10.3 mm in length, 7.5 mm in width, and 2.55 mm in height.

It functions reliably in temperatures ranging from -40°C to 85°C.

This unit supports SPI interface with Single, Dual, and Quad I/O modes.

It is compliant with the automotive standard AEC-Q100, ensuring its reliability in automotive applications.

It supports individual 4KB sector erase, 32KB half-block erase, 64KB block erase, and full chip erase functions.

This model has a pin count of 16.

It uses NOR type memory cells.

Yes, it complies with RoHS standards for environmental safety.

It is ideal for applications requiring code shadowing, direct code execution (XIP), and reprogrammable data storage.

The packaging type is SOIC, designed for surface mounting.

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