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Macronix NOR 32 MB Parallel Flash Memory 48-Pin TSOP MX29LV320EBTI-70G
Specifications
| Country of Origin | Taiwan |
|---|---|
| Brand | Macronix |
| Height | 1.05mm |
| Length | 12.1mm |
| Cell Type | NOR |
| Model | MX29LV320EBTI-70G |
| Width | 12mm |
| Mount Type | Surface |
| Series | MX29LV |
| Maximum Operating Temperature | 85°C |
| Package Type | TSOP |
| Minimum Operating Temperature | -40°C |
| Memory size | 32MB |
| Interface Type | Parallel |
| Pin Count | 48 |
| Maximum Supply Voltage | 3.6V |
| Minimum Supply Voltage | 2.7V |
| Organisation | 2M x 16/4M x 8 bit |
| Number of Bits per Word | 16 |
| Maximum Random Access Time | 70ns |
| Number of Words | 2M, 4M |
| Number of Banks | 4 |
Key Features
- Memory size of 32 MB enables substantial data storage capacity.
- Operates with a supply voltage range of 2.7 V to 3.6 V for efficient power usage.
- Maximum random access time is 70 nanoseconds ensuring fast data retrieval.
- Designed to operate within temperature range of -40°C to 85°C suitable for industrial environments.
- Features a 16-bit data word size and four independent memory banks for versatile applications.
- Compact physical dimensions of 12.1 mm length, 12 mm width, and 1.05 mm height for space-constrained installations.
- Manufactured in Taiwan, Province of China, ensuring quality and reliability.
- Surface mount device with NOR cell technology for non-volatile data retention.
Product Description
Macronix MX29LV320EBTI-70G is a 32 MB NOR Flash Memory with a 48-pin TSOP package designed for parallel interface applications. It operates within a supply voltage range of 2.7 V to 3.6 V and supports a maximum random access time of 70 nanoseconds, making it suitable for high-speed and efficient memory solutions.
This Flash Memory features a 16-bit word size organized in four banks, offering flexible memory management for embedded systems and electronic devices. The compact physical size of 12.1 mm in length, 12 mm width, and 1.05 mm height allows easy integration into surface mount assemblies, saving valuable PCB space.
Engineered to operate in harsh industrial environments, it maintains performance within a temperature range from -40°C to 85°C. The NOR cell type ensures reliable non-volatile storage, ideal for firmware storage, boot applications, and code execution in embedded and industrial control systems.
Manufactured in Taiwan, Province of China, this memory device aligns with the MX29LV series architecture featuring boot and uniform sector architectures that augment system design flexibility. While it lacks automotive-specific certification, it is suited for diverse applications including consumer electronics, industrial equipment, and telecommunications hardware.
Memory size of 32 MB provides ample storage capacity. Parallel interface supports rapid data access and program execution. 48-pin TSOP packaging simplifies surface mounting on PCB. Wide operating temperature range from -40°C to 85°C for industrial use.
Provides 70 ns random access time enhancing performance. Organized memory architecture with 4 banks and 2M x 16/4M x 8 bit organisation. Supply voltage from 2.7 V to 3.6 V ensures compatibility with various systems. Compact physical size facilitates integration into space-limited PCB layouts.
This Macronix NOR Flash Memory is engineered for industrial, manufacturing, telecommunications, embedded systems, and electronics development applications. For more advanced semiconductor and Flash Memory options, explore the full Macronix MX29LV series catalog and related product lines at EnvMart.
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Frequently Asked Questions
The Macronix NOR Flash Memory has a memory size of 32 MB, providing substantial data storage capacity.
It features a maximum random access time of 70 nanoseconds, ensuring fast data retrieval.
This model operates with a supply voltage range of 2.7 V to 3.6 V, which supports efficient power usage.
The operating temperature range is from -40°C to 85°C, making it suitable for industrial environments.
The memory is organized into four independent banks with a 16-bit data word size, allowing for versatile applications.
The dimensions are 12.1 mm in length, 12 mm in width, and 1.05 mm in height, facilitating integration into space-constrained installations.
It supports a parallel interface, which allows for rapid data access and program execution.
The package type is TSOP (Thin Small Outline Package), which simplifies surface mounting on PCBs.
The cell type is NOR, which ensures reliable non-volatile data retention.
This model is suitable for applications in embedded systems, industrial equipment, consumer electronics, and telecommunications hardware.
It is manufactured in Taiwan, Province of China, ensuring quality and reliability.
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