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onsemi 4-Element Photomultiplier Surface BGA Package ArrayC-60035-4P-BGA

Category Pliers Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 2.3mm
Length 14.2mm
Model ArrayC-60035-4P-BGA
Width 14.2mm
Mount Type Surface
Series C SiPM
Package Type BGA
Element Type Photomultiplier
Standards/Approvals J-STD-20
Number of Pins 9
Number of Elements 4
Wavelength of Peak Sensitivity 420nm

Key Features

  • Features a 4-element photomultiplier for enhanced sensitivity and resolution.
  • Peak wavelength sensitivity is at 420 nm, suitable for diverse optical detection.
  • Compact Surface Mount BGA package measuring 14.2mm x 14.2mm x 2.3mm height.
  • Equipped with 9 pins and complies with J-STD-20 standard for reliability.
  • Part of the C SiPM series allowing 4-side scalable arrays and minimal dead space for tiling.
  • Pixel signals can be individually read for imaging or summed for large area single-channel sensing.
  • Designed for medical imaging, hazard detection, 3D ranging, biophotonics, and high-energy physics applications.
  • Includes option for evaluation boards to facilitate signal access and prototyping.

Product Description

onsemi ArrayC-60035-4P-BGA 4-Element Photomultiplier in a Surface BGA package offers compact, high-performance photodetection capabilities within a robust industry-standard format.

This photomultiplier features a 4-element array allowing high sensitivity with peak sensitivity at 420 nm wavelength. It is designed with a surface mount BGA package measuring 14.2mm in length and width, and 2.3mm in height, providing a minimal footprint suitable for dense electronic assemblies.

The device has 9 pins and conforms to the J-STD-20 standard ensuring high reliability. It belongs to the C SiPM series, which supports 4-side scalable arrays with minimal dead space, allowing users to tile multiple arrays to create larger detection areas without performance loss.

The array features pixel-level signal outputs that may be individually read for imaging purposes or summed by users to form a single large-area sensor suitable for varied sensing applications.

Applications include medical imaging, hazard and threat detection, 3D ranging and sensing, biophotonics and sciences, and high energy physics research. Optional evaluation boards are available to provide easy access to signals, accelerating development and integration tasks.

Compact 4-element photomultiplier array for high sensitivity detection. Peak wavelength sensitivity of 420 nm ensures efficient photon detection. BGA surface mount package supports reliable high-density circuit board assembly.

J-STD-20 compliance guarantees product robustness and reliability. Scalable C SiPM series design supports large area sensors via array tiling. Flexible pixel signal output modes for imaging or single-channel applications.

Designed for advanced industrial, medical, and scientific photodetection use cases. Includes evaluation boards to aid in design and testing phases.

Explore the onsemi range for high-quality photomultiplier solutions suitable for diverse industrial and scientific applications. Visit EnvMart for more electronic components and optoelectronics products.

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onsemi 4-Element Photomultiplier Surface BGA Package ArrayC-60035-4P-BGA
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Frequently Asked Questions

The peak wavelength sensitivity of this photomultiplier is at 420 nm, making it suitable for diverse optical detection applications.

This model has dimensions of 14.2 mm in length, 14.2 mm in width, and a height of 2.3 mm.

The BGA package is equipped with 9 pins.

It features a surface mount type, suitable for high-density circuit board assembly.

This unit complies with the J-STD-20 standard, ensuring reliability in its application.

It belongs to the C SiPM series, which supports scalable arrays with minimal dead space.

It is designed for applications in medical imaging, hazard detection, 3D ranging, biophotonics, and high-energy physics.

Yes, the pixel signals can be individually read for imaging purposes or summed for large area single-channel sensing.

This model features a 4-element photomultiplier array.

Yes, optional evaluation boards are available to facilitate signal access and prototyping.

The country of origin for this product is India.

It uses a BGA (Ball Grid Array) package type, which is compact and suitable for dense electronic assemblies.

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