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Macronix NAND 1 GB SLC Parallel Flash Memory 48-Pin TSOP MX30LF1G18AC-TI
Specifications
| Country of Origin | Taiwan |
|---|---|
| Brand | Macronix |
| Height | 1.05mm |
| Length | 12.1mm |
| Cell Type | NAND |
| Model | MX30LF1G18AC-TI |
| Width | 18.5mm |
| Mount Type | Surface |
| Series | MX30LF |
| Maximum Operating Temperature | 85°C |
| Package Type | TSOP |
| Minimum Operating Temperature | -40°C |
| Memory size | 1GB |
| Interface Type | Parallel |
| Pin Count | 48 |
| Maximum Supply Voltage | 3.6V |
| Minimum Supply Voltage | 2.7V |
| Organisation | 128M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 25ns |
| Number of Words | 128M |
Key Features
- Memory capacity of 1 GB with 128M x 8 bit organization ensures ample storage.
- Operates with a minimum supply voltage of 2.7V and a maximum of 3.6V.
- Supports maximum random access time of 25 ns for swift data retrieval.
- Wide operating temperature range from -40°C to 85°C ensures durability in harsh conditions.
- Compact dimensions of 12.1mm length, 18.5mm width, and 1.05mm height for easy PCB integration.
- Mounted using a surface-mount technology suitable for automated assembly.
- Designed without automotive certification but suitable for diverse electronics applications.
- Manufactured in Taiwan, Province Of China with industry-standard compliance.
Product Description
Macronix MX30LF1G18AC-TI is a NAND Flash memory device offering 1 GB of storage capacity. This Single-Level Cell (SLC) flash memory utilizes a parallel interface with a 48-pin Thin Small Outline Package (TSOP) form factor. The device is engineered for robust performance and integration in industrial, electronic component, semiconductor, and memory chip applications.
This Surface Mounted Device (SMD) supports organization of 128M x 8 Bit with a maximum random access time of 25 nanoseconds, enabling efficient high-speed data access. The memory operates within supply voltages of 2.7V to 3.6V and withstands ambient operating temperatures from -40°C up to 85°C, making it suitable for many embedded electronics environments.
Physically, the chip measures 12.1mm in length, 18.5mm in width, and has a height of 1.05mm, supporting compact PCB layouts. While it lacks automotive-specific certifications, its robust specifications suit industrial, manufacturing, and electronic design applications where reliable non-volatile memory is essential.
1 GB memory size with 128M x 8 Bit organization. Parallel interface for straightforward connectivity. 48-pin TSOP package for surface mounting. Operating temperature from -40°C to 85°C ensures wide environmental tolerance.
Supply voltage range of 2.7V to 3.6V for consistent operation. Maximum random access time of 25 ns for rapid data retrieval. Manufactured origin: Taiwan, Province Of China. Ideal for use in electronic assemblies, power and connector systems, semiconductor devices, and memory chips requiring persistent storage.
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Frequently Asked Questions
This model offers a memory capacity of 1 GB with an organization of 128M x 8 bits.
The maximum random access time for this NAND Flash memory is 25 nanoseconds, allowing for swift data retrieval.
The physical dimensions of this unit are 12.1 mm in length, 18.5 mm in width, and 1.05 mm in height.
It operates within a supply voltage range of 2.7V to 3.6V.
The operating temperature range for this NAND Flash memory is from -40°C to 85°C.
This model is packaged in a 48-pin Thin Small Outline Package (TSOP).
It is designed for surface mounting, suitable for automated assembly processes.
This unit utilizes a parallel interface for straightforward connectivity.
The MX30LF1G18AC-TI is manufactured in Taiwan, Province Of China.
It is suitable for use in various electronics applications, including industrial and manufacturing environments.
This model uses Single-Level Cell (SLC) technology for its NAND Flash memory.
The memory organization is 128M x 8 bits, allowing efficient data storage and access.
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